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Sapphire Surpasses GaAs in the Substrate Stakes

June 08, 2010
Yole Développement survey of substrate usage in the compound semiconductor industry predicts Sapphire will exceed 50% of the CS processed surface in 2011

Yole Développement has released its new markets & technological study ‘Compound Semiconductor Substrates 2010 Report’ and has revealed thatsapphire will exceed 50% of the compound semiconductor substrates processed surface.

The report predicts the CS materials market from 2013 and beyond and describes the current developments and new innovations.

For each material, GaAs, GaP, GaN, SiC,InP and Sapphire, it provides the main targeted devices and related market size.



Yole’s analysts list the main material suppliers (merchant and captive) with product description and market shares. They also analyze the main material users and the related products. The report presents the substrate market value and volume ($, units, Msq.in.), split by diameter and electrical specs (Semi-conductive, semi-insulating) in the 2008-2013 time frame.

Although silicon dominates the semiconductor business as the reference material, GaAs, GaN, GaP, GaAs, InP, SiC and Sapphire substrates now account for 1.1% of the 7,504 million square inches annually processed in semiconductor foundries.

However, that small portion of processedarea is compensated by a higher merchant price leading to a $880M raw substrate market size in 2009 and reaching the billion dollar threshold in 2010.

Up to now, GaAs was the leading material in volume thanks to the wireless technology and red /orange / yellow LED demand, but sapphire will take the lead from 2011 driven by the booming business in white LED for LCD backlight and general illumination.

These materials have been protected from silicon competition because they offer better frequency, power, thermal conductivity, robustness, junction temperature, and voltage breakdown. Even though compound materials have market prices dramatically higher than Si, technical specifications have been, and will remain, the main driver for the adoption of these CS substrates and related technologies.

All the considered materials are now available in a 4 inch format except bulk GaN that has just been released in 3 inch in Japan. This diameter expansion helps to lower the manufacturing cost of CS-based devices and to mass market affordable products.

This new report offers a unique panorama of the compound semiconductor substrate business in a single package. It highlights the main metrics and the key market trends that will help material and equipment vendors to position their R&D efforts and anticipate the changes and forecasted evolution of their business.

Companies listed in this report are listed below:

Acme Corporation, AdTech, Agility, Alpha Crystal, Alphion, Ammono Sp, Anadigic, AOI, Avago, Avanex, AWSC, AXT,

Bookham, Bridgestone, ComSeCore, Cotomat, Covega, Cree, Crysband, Crystal Applied Technology, Crystal On, Crystal Photonics, Crystal Q, Crystalwise, Cyoptics,

Denselight, Denso, Dow Corning, Dowa,

Elma Malachit JSC, Epistar, Epiworks, Eudyna, Exiton,

Finisar, Freiberger, Fujitsu, Furukawa,

GCS, GE, GigaCom, Goldeneye Inc.,

Hitachi (OpNext), Hitachi Cable, Hittite Microwave, HRL,

II-VI, Iljin Display, Infinera, Inlustra Technologies LLC, InPACT, IntelliEPI, Intexys Photonics, IQE,

JDSU, Juropol,

Kopin, Kyma, Kyocera,

Lumileds, LumiLOG,

M/A-Com, Magnachip, Mimix Broadband, Mitsubishi Chemical, Mitsubishi Electric, MJ Corporation, Modulight, Monocrystal PLC, Multiplex,

Namiki, NanoGaN Ltd., N-Crystals, NEC, Neomax, NeosemiTech, Nikko Materials / Acrotec, Nippon Steel, Norstel, Northrop Grumman, NTT,

OKI, OMMIC, Ostendo, Oxford Inst. / TDI,

 PAM Xiamen, Panasonic, Peregrine, Phostec, Picogiga,

Renesas, RMFD, Rohm, Rubicon,

Saint-Gobain Crystals, Samsung-Corning, Santur, Sapphicon, Sapphire Technology, SEH,

Sensor Electronic Technology: SET, Shinkosha, Showa Denko, Si-Crystal, Silian, Sino American SAS, Skyworks, Sony, Soraa, Inc., Sumika, Sumitomo Electric SEI, Sumitomo Metal Mining, Svedice,

TankeBlue, Tera Xtal Technology, Thales, TOPCO Scientific, TopGaN, TriQuint,

UCSB, UMS, Unipress,

Vitesse, VPEC, Wafer Tech. / IQE,

Wafer Works, Win Semi,

Xiamen Powerway, Xindium.

The ‘Compound Semiconductor Substrate Report’ Catalogue price (single user license) is €3,990 and will be published on 10 May 2010.

Special offers and pricing in dollars can be obtained from David Jourdan  by emailing jourdan@yole.fr or calling +33 472 83 01 90.
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