Latest In the fab news
In the fab news RSS feedImproved bubblers smooth metalorganic flows Jul 4, 2008
If MOCVD process engineers want greater control over their vapor concentrations then they should consider our upgraded VaporStation, says Rohm and Haas.
On-wafer RF probe raises throughput Jul 3, 2008
The 12-contact Unity probe combines RF signal, logic, power and ground in-line engineering tests for frequencies up to 20 GHz, and will soon scale to 24-contacts and 80 GHz.
RFMD casts GaN in starring cable TV role Jun 26, 2008
Producing GaN HEMTs on its existing GaAs manufacturing lines means that the RF chipmaker will be shipping them in its latest cable TV modules this year.
Smallest Jazz process offers lean, green chips Jun 20, 2008
The latest 0.18 micron SiGe foundry capability offers improved integration and efficiency as the company looks forward to its future under Tower Semiconductor's ownership.
MMIC amps make a small noise for Ommic Jun 19, 2008
The latest GaAs chips for wireless infrastructure from the European foundry use its PHEMT process to combine high linearity and low noise figures.
Toshiba's GaN plan targets 'PA Porsche' mantle Jun 18, 2008
The Japanese company hopes high-power devices, such as the market-leading HEMT that it's bringing into production, will enable it to succeed in a tight RF GaN market.
Tegal eyes acquisitions in tough market Jun 17, 2008
Semiconductor equipment vendor Tegal Corporation says that its strong finances put it in a position to take advantage of weakened competitors who are feeling the strain.
Defects targeted for InGaN laser improvement Jun 9, 2008
Better control of crystal quality is "strictly necessary" to improve blue laser diode reliability, finds an extensive study by laser manufacturer Panasonic and a team at the University of Padova.
SAFC scales up precursor delivery Jun 2, 2008
The chemical company is helping high-volume LED manufacturers automate the flow of reagents into their deposition tools.
CrystalQ targets sapphire bottleneck May 23, 2008
The sapphire crystal growth industry has gained another player, with its eye on improving substrate supply for LED and RF chip manufacturers.
Latest In the fab features
In the fab features RSS feedIQE's epiwafers unite III-Vs and silicon Apr 1, 2008
Attempts at growing III-Vs on conventional silicon tend to end in failure. But germanium-based composites and off-axis silicon can provide a platform for high-performance chips for digital logic and broadband RF applications, say Dmitri Lubyshev, Joel Fastenau and Amy Liu.
Product Showcase Mar 17, 2008
Lake Shore Cryotronics and Oxford Instruments
Novel layers enhance red-LED extraction efficiency Mar 17, 2008
Better extraction efficiencies for red LEDs are now possible, thanks to specially designed transmitting and reflecting layers that feature in two of Epistar's latest product lines, say the company's Tzer-Perng Chen and Min-Hsun Hsieh.
Product Showcase Feb 11, 2008
Gatan UK, Logitech Ltd and Bruker AXS
Argon aids p-doping in GaN LEDs Feb 11, 2008
If you want p-type GaN with sharp p-doping profiles and low resistivity, then consider switching your carrier gas from hydrogen to argon, say Vladimir Dmitriev and Alexander Usikov from Technologies and Devices International.
Wafer-scale approach simplifies hermetic packaging Feb 11, 2008
Hermetic wafer-level packaging can cut the cost and weight of III-V MMIC protection and offer a route to combining different types of chip in a single compact module, say Patty Chang-Chien, Xianglin Zeng, Yun Chung and Jeff Yang from Northrop Grumman Space Technology.
TriQuint joins the integration game Dec 10, 2007
TriQuint Semiconductor has united its HBTs and PHEMTs with a BiHEMT process that promises to integrate power amplifiers and antenna switches on the same chip, according to Tim Henderson.
Product Showcase Dec 10, 2007
An innovation from MicroChem
Photoresist cuts strengthen Skyworks' gross margin Dec 10, 2007
Six Sigma analysis has driven substantial cuts in Skyworks' photoresist consumption and has resulted in savings in excess of $450,000, according to Jens Riege.
Product Showcase Nov 12, 2007
Innovations from MicroChem, Lake Shore Cryotronics and Filtronic Compound Semiconductors.