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Compound Semiconductor Buyer's Guide 2008

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The Buyer's Guide 2008

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  1. FC300 – High Force Device Bonder
    S.E.T. Smart Equipment Technology Jul 3, 2008

    The FC300 is a new generation of high accuracy and high force device bonder for wafers up to 300mm.

  2. EpiTT – the production line sensor
    LayTec GmbH Jul 3, 2008

    EpiTT is an ideal in-situ sensor for maximizing yields in GaN/LED mass-production environments.

  3. Model 2636 Dual-channel System SourceMeter Instrument (Low Current)
    Keithley Jul 3, 2008

    The dual-channel Model 2636 is part of Keithley's family of multi-channel I-V test solutions.

  4. KADETT – High Accuracy Placement & Bonding
    S.E.T. Smart Equipment Technology Jul 3, 2008

    The KADETT is a flexible and open platform for placement and bonding of devices on substrates.

  5. LumiLase - 830nm, 50mW in 5.6mm TO-can
    Modulight Inc Jul 3, 2008

    830 nm single-mode laser in 5.6mm TO-can for industrial applications. More info: sales@modulight.com

  6. Model FC-4400 Load-Lock Evaporator for High Volume Lift-Off Applications
    Temescal, a part of Edwards Vacuum, Inc Jun 3, 2008

    The ultimate high vol production evaporation metallization tool for Compound Semiconductor processes

  7. Model FC-2800 Mid-sized Load-Lock Coater for Production
    Temescal, a part of Edwards Vacuum, Inc Jun 3, 2008

    Ultimate high volume evaporation metallization tool for <6" wafer Compound Semiconductor processes.

  8. BJD/FC2000 Bell Jar R&D Evaporator
    Temescal, a part of Edwards Vacuum, Inc Jun 3, 2008

    The ultimate R&D evaporation metallization tool for advancing Compound Semiconductor processes.

  9. Electron Beam Gun & Power Supply Packages
    Temescal, a part of Edwards Vacuum, Inc Jun 3, 2008

    Temescal has developed the most fully integrated e-gun/power supply/sweep controller pkgs available.

  10. kSA MOS In-Situ 2D Stress Monitoring System
    k-Space Associates, Inc. May 16, 2008

    Directly measure 2D curvature, stress, reflectivity from thermal & thin film processes in real time.