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Finisar Innovators at ECOC 2018

Speakers focus on challenges and opportunities within the optics Industry

Finisar, an optical communications company, has announced a line-up of speakers at the upcoming ECOC 2018 Conference and Exhibition in Rome September 23- 27, 2018.

Martin Zirngibl, CTO will be a workshop panelist in the session: 'High-volume applications of 3D Sensing in consumer and automotive markets'. He will also give a presentation on 'Future of pluggability for multi-tb/s data center interconnects'.

Julie Eng, executive VP and general manager on 3D sensing will be a panelist in the session 'Building Inclusive Organisations: Women in Photonics'.

Chris Cole, VP of advanced development will be a workshop panelist in a session on 'Data Centres'.

Connecting the Compound Semiconductor Industry

The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.

Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.

To discover our sponsorship and exhibition opportunities, contact us at:

Email: info@csinternational.net
Phone: +44 (0)24 7671 8970

To register your place as a delegate, visit: https://csinternational.net/register

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