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CSConnected wins £50k seed funding

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Wales-based compound semiconductor cluster gets ready to bid for £10m and £50m UKRI projects

CSconnected, a Wales-based cluster of organisations associated with research, development, and manufacturing of compound semiconductors, is one of 24 projects to receive £50k in early-stage funding from UK Research and Innovation’s (UKRI) Strength in Places Fund.

Teams behind these projects which range from from pharmaceuticals to aerospace, and transport to the creative economy, will submit these bids to UKRI in late 2019, with four to eight of the strongest set to receive between £10m and £50m each to carry out projects designed to drive substantial economic growth.

CSconnected is the world’s first Compound Semiconductor cluster. It combines the advanced semiconductor expertise of IQE, SPTS Technologies, Newport Wafer Fab and Microsemi, along with academic partners and the UK Government’s £50million compound semiconductor applications Catapult.

With a combined budget of more than £7 billion, UK Research and Innovation brings together the Arts and Humanities Research Council; Biotechnology and Biological Sciences Research Council; Engineering and Physical Sciences Research Council; Economic and Social Research Council; Innovate UK; Medical Research Council; Natural Environment Research Council; Research England; and Science and Technology Facilities Council.

Announced in November 2017, the Strength in Places Fund will benefit all nations and regions of the UK by enabling them to tap into the world-class research and innovation capability that is spread right across the country. The fund brings together research organisations, businesses, and local leadership on projects that will lead to significant economic impact, high-value job creation and regional growth.

Connecting the Compound Semiconductor Industry

The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.

Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.

To discover our sponsorship and exhibition opportunities, contact us at:

Email: info@csinternational.net
Phone: +44 (0)24 7671 8970

To register your place as a delegate, visit: https://csinternational.net/register

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