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WiPDA-Asia To Take Place Virtually And Physically


IEEE conference in September to add virtual booths and virtual attendee options

The Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA-Asia) will be run as a 'hybrid' conference from September 23-25, 2020 at Kyoto University, Japan. As such, it will be one of the first IEEE conferences to cater for both in-person attendees and those that are not able to travel to the workshop due to potential continuing coronavirus (COVID-19) imposed restrictions.

The conference is modifying its sponsorship structure and adding virtual booth and virtual attendee options for organisations. This will enable companies to have a presence at this important meeting through the workshop's virtual exhibit available on the workshop website.

Furthermore, the organising committee is making provisions in the actual workshop schedule to have pre-recorded informative sponsor content pertaining to wide bandgap technologies to be played during the workshop to maximise views by both virtual and in-person attendees!

These pre-recorded spots must strictly adhere to the times that will be allotted, but this is an unprecedented option being piloted by WiPDA-Asia. Guidelines are being developed to share with you in this regard.

Topics that will be covered include; Hetero-epitaxial and bulk materials growth; Packaging, power modules, and ICs; Gate dielectrics and surface passivation; Hard-switched and soft-switched applications; Device structures and fabrication techniques; Common-mode and EMI management; Device characterisation and modelling; Gate drive and other auxiliary circuits; Very high efficiency and compact converters; High-performance passive components; SOAs including short-circuit, spike,and transient tolerance; Applications in renewable energy and storage, transportation, industrial drives, and grid power; Harsh environment (e.g. high temperature) operation and reliability.

CS International to return to Brussels – bigger and better than ever!

The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.

Join us face-to-face between 28th – 29th June 2022

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
  • Email info@csinternational.net  or call +44 (0)24 7671 8970 for more details.

*90% of exhibition space has gone - book your booth before it’s too late!


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