+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
Vendor View

Macom at IMS 2022

News

Company to demo RF and microwave amplifiers, MMICs and switches at Denver conference in June

Macom will demonstrate a new products for telecom, satcom, aerospace and defence, test and measurement and industrial use at IEEE’s International Microwave Symposium (IMS) in Denver, Colorado, June 21 – 23, 2022.

Product demonstration include new, customisable RF Pallet designs using Macom PURE CARBIDE GaN amplifiers and integrated power management solutions. For radar, it will show a high-voltage power amplifier with greater than 4.5kW output power performance.

For satcom, it will demo Ka-Band GaN MMICs for pulsed and continuous wave (CW) power applications, and advanced E-Band MMIC solutions with a power amplifier combiner using waveguide WR-12 packaging. Macom will also demonstrate 8W and 10W Power Amplifier Modules (PAMs) for 5G mMIMO applications.

The switch product demonstrations will showcase Macom’s high-frequency Silicon on Insulator (SOI) and AlGaAs switch performance.

CS International to return to Brussels – bigger and better than ever!


The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.


Join us face-to-face on 18-19 April 2023

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and Power Electronics International.
  • Email info@csinternational.net  or call +44 (0)24 7671 8970 for more details.

Register

Indium Precision Au-Based Die-Attach Preforms at SPIE Photonics West
ROHM and BASiC Semiconductor form a strategic partnership
Indium Introduces LED Paste for Advanced Mini/MicroLED Applications
SiC to service buses and trucks
STMicroelectronics and Soitec cooperate on SiC substrate manufacturing technology
Midsummer signs four LOI’s for 224 MW of thin film panels
OLED display technology in smartphones on the rise
Innoscience signs global deal with Richardson RFPD
Onsemi ramps SiC production
Fairview releases temperature-compensated amps
Kyocera develops novel GaN laser chip
BluGlass partners with Ganvix on green VCSELs
Scantinel lands €10M for next gen LiDAR
Researchers control light quanta with sound waves
Rohm, Mazda, and Imasen sign SiC e-Axle deal
HKUST team develops way to couple III-V and silicon
Veeco appoints Lena Nicolaides to board
Filtronic opens design centre in Manchester
Hunan Sanan secures $524M SiC order from NEV brand
BluGlass shows feasible reliability of GaN laser diodes
Perovskite-CIGS tandem is over 21 percent efficient
Silanna UV targets nitrate sensing applications
BorgWarner to invest $500M in Wolfspeed
UK orders Nexperia to divest Newport Wafer Fab
Ayar Labs partners with DoD on optical I/O
UV-A LED has 75 percent higher power density
Quantum Science secures grant funding
3C-SiC enhances the GaN HEMT
Cambridge GaN Devices secures $19M investment
Particle Measuring Systems introduces 10 nm aerosol particle counter
Innoscience adds 80mΩ RDS(on) 650V GaN HEMTs
Power Integrations shrinks flyback switchers
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: