Loading...
News Article

Innoscience signs new design-in partner

News

CODICO to support designers at the ‘start of their GaN journey, through to full production’

GaN company Innoscience has announced a distribution deal with CODICO GmbH, covering all European countries.

CODICO (an abbreviation of ‘The COmponent Design-In COmpany’) is a privately owned distributor with headquarters near Vienna in Austria, product competence centres in Munich (Germany), Treviso (Italy) and Stockholm (Sweden), and 43 offices in 12 countries. It provides technical support from the initial development phase through to the end product, for a range of active, passive and electromechanical electronic components.

Denis Marcon, Innoscience’s general manager, Europe said: “Most customers are only at the start of their journey with GaN products, therefore, even though are parts are rugged, reliable and easy to use, designers will need a lot of technical support as they transition from silicon to these WBG parts. We are confident that CODICO is able to provide the technical expertise required to enable our customers to reap the benefits GaN offers.”

Thomas Berner, product management at CODICO, added:: “Innoscience offers both discrete (InnoGaN) and integrated (SolidGaN) GaN power solutions and is poised to be the world’s largest dedicated GaN producer with two 8-inch wafer fabs already in production. Therefore, having Innoscience on board supports our plans to grow in our target segments industrial, renewable energies and e-mobility. Innoscience’s high-performance and reliable GaN-Fets match our strategy to deliver technical state-of-the art components to our customer-base and complements to the drivers we already offer.”

Improving annealing conditions for GaN MOSFETs
NREL publishes Si-perovskite tandem analysis
Indichip Semis to build $1.4b SiC fab
Printing high-speed modulators on SOI
Sivers signs CHIPS Act contracts
Photon IP raises €4.75m for advanced PICs
Imec makes breakthrough with GaAs lasers on silicon
VueReal appoints VP of semiconductor engineering
Plessey and Meta announce brightest red microLED display
Laser Thermal wins contract from Louisiana Tech University
Riber gets repeat US order for MBE 412 cluster
Na‑flux method improves GaN device performance
X-Rite introduces booth for LED-based colour evaluation
Quantum Science signs QD technology deal
Penn State makes breakthrough in photonic switching
Rohm develops 1kW class IR laser diode
US ITC says Innoscience infringed EPC GaN patent
Aledia's microLED line is ready to roll
China adds more US firms to export control List
Imec shows outdoor stability of perovskite modules
Chiplets set to transform electronics, says IDTechEx
Riber secures production system order in Europe
FBH to present novel lasers at Photonics West
US DOE awards $179m for fundamental chip research
Polar Light Tech makes microLED breakthrough
Precursor modulation enhances DUV LED efficiency
US Government to probe Chinese chip trade practices
EPC Space achieves JANS MIL-PRF-19500 certification
HKUST team develops DUV microLED chips for lithography
Porotech partners with Foxconn on microLEDs
Scientists make laser-based artificial neuron
NS Nanotech shows benefit of far-UVC in ambulances
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: