+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

OCP snaps up Taiwan's Gigacomm for $20m cash

In a bid to become a bigger player in the Japanese market, US-based Optical Communication Products is set to acquire fellow optical component and module vendor Gigacomm.

Optical Communication Products (OCP) is to acquire Taiwan-based laser, detector and module vendor Gigacomm for $20 million in cash.

The Woodland Hills, CA, firm, which closed its dilute-nitride VCSEL operation earlier this year, hopes to fulfill its intention to move into the emerging market for fiber-to-the-home (FTTH) equipment through the deal (see related story).

Gigacomm is said to be the leading supplier of FTTH modules in Japan, currently the world's largest market for such gear. NTT has a vigorous plan for deployment of the technology and a recent market report from Heavy Reading predicted that by 2011, 86 million households will be hooked up with an FTTH link globally.

The Taiwanese company, which is located in the Hsinchu Science-based Industrial Park, also sells III-V optical components including VCSELs, edge-emitting lasers and photodiodes to some of Japan's leading communications equipment vendors, including Mitsubishi Electric.

OCP's CEO Muoi Van Tran said, "The acquisition gives us increased capacity through [Gigacomm's] integrated manufacturing facility, an important second - and competitive - source of lasers, and a talented pool of engineers and management."

Mitsubishi Electric's purchasing department says that it has bought over a million modules from Gigacomm over the past year.

With current investors including Epistar and Taiwan's Industrial Technology Research Institute, Gigacomm will become a wholly-owned subsidiary of OCP's once the deal has been finalized. Gigacomm CEO Jacob Tarn will remain in charge of the operation.

Connecting the Compound Semiconductor Industry

The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.

Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.

To discover our sponsorship and exhibition opportunities, contact us at:

Email: info@csinternational.net
Phone: +44 (0)24 7671 8970

To register your place as a delegate, visit: https://csinternational.net/register

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: