+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

In brief: OptoGaN, Peregrine, Williams AM

Finnish start-up OptoGaN raises €5 million in venture capital; silicon-on-sapphire specialist Peregrine and its partner Oki Electric are now manufacturing 2.5 million "UltraCMOS" devices every week; metals supplier Williams Advanced Materials opens a new facility in the Czech Republic.

OptoGaN bags €5 million
OptoGaN, an LED-focused start-up company based in Finland, has closed a €5 million ($6.8 million) round of funding led by the Nordic Venture Fund and Denmark-based Via Venture Partners.

The company, which has pilot line facilities available in Dortmund, Germany, is developing a way to reduce dislocation densities using a multi-step growth process.

OptoGaN CEO Bernd Meyer says that he is convinced that the company will become a leading manufacturer of LED chips.

Peregrine and Oki ramp UltraCMOS
Peregrine Semiconductor, the San Diego company that specializes in silicon-on-sapphire chip technology, is now shipping products in much larger volumes through its manufacturing partner Oki Electric Industries.

Collectively, Oki and Peregrine are now manufacturing 2.5 million so-called "UltraCMOS" devices per week and shipping to customers in the mobile handset, digital TV and communications infrastructure markets.

The pair are now set for a major expansion - Oki will support production of ten new UltraCMOS products this year, said the Japanese company.

Williams gets Bohemian
Specialty materials supplier Williams Advanced Materials has expanded its European operation with a new precision cleaning and reconditioning services facility in Louny, Czech Republic.

The new site signals the expansion of Williams physical vapor deposition (PVD) materials business in Europe, while the company is also in the process of opening a new PVD operations and services center near Shanghai in China.

Connecting the Compound Semiconductor Industry

The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.

Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.

To discover our sponsorship and exhibition opportunities, contact us at:

Email: info@csinternational.net
Phone: +44 (0)24 7671 8970

To register your place as a delegate, visit: https://csinternational.net/register

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: