+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

ALLVIA expands with Oregon fab purchase

Through-Silicon Via Foundry, ALLVIA, has acquired a manufacturing site in Oregon and announces equipment tool selection process

ALLVIA, the first through-silicon via (TSV) foundry, has purchased a manufacturing facility in Hillsboro, Oregon, for high volume production of their products with TSV technology. The former semiconductor equipment manufacturing facility is a 178,000 square foot building with 60,000 square feet of cleanroom capacity. The cleanroom is expandable to 80,000 square feet.


Over the next several months ALLVIA will proceed with manufacturing equipment tool selection for through-silicon via production. They expect the facility to be operational in 2010 but no specific opening date has yet been established.


Currently ALLVIA manufactures in Sunnyvale, CA, offering TSV prototyping and some volume production. The company will keep both facilities operational for the foreseeable future and gradually move full volume production to the Silicon Forest region of northwest Oregon as that facility builds out and ramps up.


“In addition to the attractive purchase price of the building,” commented Sergey Savastiouk, CEO of ALLVIA, “there is a tremendous talent pool of engineers and fab personnel in that community of Oregon. And operating expenses, particularly electricity and water, but also including taxes, are much more affordable compared to Silicon Valley.”

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: