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Worldwide demand for solar panels, shingles and modules will surge to almost 2.4 GW by 2016.

Historically, building-integrated photovoltaics (BIPV) has been relegated to a niche market because solar modules and panels have simply cost too much and have been too difficult to install on residential and commercial roofs as well as building walls, windows and other parts of the building structure.

Additionally, production of BIPV products with appealing aesthetics has been limited. Starting in 2010, however, BIPV market dynamics will change and worldwide demand for solar panels, shingles and modules will surge to almost 2.4 GW by 2016.


Adoption of BIPV and building-applied photovoltaics (BAPV) is being driven by several key market developments including a rapidly falling installed cost per watt; greater ease of installation on rooftops primarily by means of new, high-efficiency CIGS-technology panels and shingles; improved aesthetics of BIPV/BAPV materials with the introduction of solar tiles and shingles that blend into rooftops; newly instituted generous feed-in tariffs in several countries; efficiency improvements in both c-Si modules and flexible thin film panels and shingles; an enhanced supply chain for BIPV/BAPV solar products; and an increasing desire to “go green” by owners of residences and commercial buildings.

This Pike Research report examines the expanding global markets for BIPV and BAPV including a comprehensive analysis of demand drivers and economics, technology issues, and key industry players. The report includes base case and upside scenario forecasts for BIPV/BAPV installed capacity by world region and technology, along with forecasts of wholesale market revenues through 2016.


Connecting the Compound Semiconductor Industry

The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.

Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.

To discover our sponsorship and exhibition opportunities, contact us at:

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