News Article
CSTG completes qualification of Hamilton wafer fabrication facility
Compound Semiconductor Technologies Global announces that it has completed the qualification of its Hamilton wafer fabrication plant, following the acquisition of the facility from Intense Ltd in January 2010.
In addition to providing continuity of supply of all high power laser products to Intense throughout the qualification period, transfer of all products from the former facility on the West of Scotland Science Park was completed at the end of September.
The Hamilton facility is now engaged in the manufacture of a wide range of GaAs and InP foundry products including high power 650nm-1.6um lasers, 1310nm-1550 single mode lasers and gain elements, semiconductor optical amplifiers, super luminescent LEDs, quantum cascade lasers, InGaAs detectors and custom monolithic chip solutions.
CEO Neil Martin commented, ‘We set ourselves a very aggressive timetable of an exit from the former facility within 6 months which included equipment transfer and staff consolidation. I am pleased to report that the Hamilton acquisition will fulfil its aim in allowing us to continue our expansion with both enhanced capacity and capability to service growth in all sectors of the compound semiconductor markets.’
Engineering focus is now shifting to expanding the portfolio of foundry processes into materials technologies such as Gallium Nitride and Antimonides, and device technologies such as Quantum Cascade lasers, VCSELs and high speed edge emitting lasers.
Connecting the Compound Semiconductor Industry
The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.
Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.
To discover our sponsorship and exhibition opportunities, contact us at:
Email: info@csinternational.net
Phone: +44 (0)24 7671 8970
To register your place as a delegate, visit: https://csinternational.net/register
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The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.
Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.
To discover our sponsorship and exhibition opportunities, contact us at:
Email: info@csinternational.net
Phone: +44 (0)24 7671 8970
To register your place as a delegate, visit: https://csinternational.net/register
Register
