+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
*/
News Article

SEMI standards approves new standard ‘SiC Defect Catalogue’

At the meeting, held on 21st March, the main advantages of standards for the industry were summarised.

A meeting of the SEMI standards European Compound Semiconductor Technical Committee was held in Frankfurt, Germany, on 21st March, the day before the CSEurope Conference. 

Before the main committee meeting commenced, a short standards information session was held for the benefit of new participants.

The main advantages of standards for the industry were summarised. Chief among these are the opportunity to produce simpler and cheaper products by avoiding unnecessary options, and the ability to freely exchange material processes and suppliers where standardised verification procedures are in use.

The lessons learned from the history of GaAs, where two different flat options still are in use today because standards were not introduced in time to prevent this, were emphasised.

Standardisation is an open, transparent and global process, which is driven by volunteers worldwide for the benefit of the semiconductor industry.

At the main committee meeting a ballot review on the new proposed standard ‘SiC Defect Catalogue’ was performed and the document was approved for publication as a new standard.

In addition to this a ballot review on the 5-year review of SEMI M54-0404 ‘Guide for Semi-insulating (SI) GaAs Material Parameters’ was carried out and the standard was re-approved without change. The status of the other active task forces in this committee, which are addressing Carbon in GaAs and Determination of Etch Pit density in GaAs & InP, was reported.

The next meeting will be held in Würzburg, Germany in April. Further details are available at www.semi.org/standards or from the co-chair Arnd.Weber@Sicrystal.de.
Connecting the Compound Semiconductor Industry

The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.

Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.

To discover our sponsorship and exhibition opportunities, contact us at:

Email: info@csinternational.net
Phone: +44 (0)24 7671 8970

To register your place as a delegate, visit: https://csinternational.net/register

Register
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: