News Article
Silicon carbide inverters offer a lot to railcar users
Mitsubishi Electric is launching SiC power modules which should enable more compact, energy-efficient and quieter railcar systems.
The firm’s next-generation traction inverter system incorporates large-capacity SiC power modules.
Mitsubishi Electric says that railcar systems fitted with the traction inverter will achieve 30% energy savings, require less maintenance and emit less noise than conventional silicon power modules. The first commercial application, following a series of ongoing field tests starting January 2012, is expected to be in railcars of Tokyo Metro.
SiC inverter for railcars
Compared to silicon-based power modules used in current traction inverters, the newly developed SiC power module offers a number of important improvements. In addition to 30% reduced power loss in the traction inverter, inverter size and weight have been reduced by 40%.
The new inverter system also enhances the performance of regenerative brakes, which will lead to producing more regenerative electricity. Incorporating two 1,700V and 1,200A SiC chips, the new inverter's high-frequency switching capability also achieves 40% less power loss in the motor. What’s more, the new inverter emits up to 6dB less noise compared to conventional models.
Railways are garnering renewed attention as a means of reduced-carbon transportation. Continued improvements in railcar equipment performance, including Mitsubishi Electric's new inverter system, are expected to lower the environmental impact of railways even further.
Connecting the Compound Semiconductor Industry
The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.
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The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.
Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.
To discover our sponsorship and exhibition opportunities, contact us at:
Email: info@csinternational.net
Phone: +44 (0)24 7671 8970
To register your place as a delegate, visit: https://csinternational.net/register
Register
