News Article
NEDI to develop power devices and LEDs with Aixtron tools
The Chinese firm will use one of the two reactors to produce 4” arsenide and phosphide based LED materials and the other to produce 4” silicon carbide based epiwafers.
Aixtron SE has announced that Nanjing Electronic Devices Institute (NEDI), an existing customer and a leading manufacturer of electronic components in China, has placed an order for one AIX 2600G3 IC system in a 12x4-inch wafer configuration and one VP2400HW with 6x4-inch wafer capacity.
NEDI will use the systems to investigate power devices and LEDs.
Following delivery in the third and fourth quarter of 2011, the new systems will be installed and commissioned by a local Aixtron service support team alongside the company’s already existing Aixtron MOCVD systems at the company’s state-of-the-art facility located in the JiangNing Economic & Technological Development Zone, NanJing China.
Kun Chun Mao, who is in charge of purchasing these systems at NEDI, comments, “These are not our first Aixtron MOCVD systems but they will play a vital part in our planned development of materials for power devices and LEDs. My team is very familiar with the technology and they trust Aixtron’s advanced technology with its ease of use, versatility as well as process compatibility with our existing recipes and procedures.”
“We have also been very satisfied with the first-class local support provided by the Aixtron service office and the enlarged spare parts stock in Shanghai. This partnership will serve us well when we begin operations with the new reactors,” he continues.
Connecting the Compound Semiconductor Industry
The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.
Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.
To discover our sponsorship and exhibition opportunities, contact us at:
Email: info@csinternational.net
Phone: +44 (0)24 7671 8970
To register your place as a delegate, visit: https://csinternational.net/register
Register
The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.
Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.
To discover our sponsorship and exhibition opportunities, contact us at:
Email: info@csinternational.net
Phone: +44 (0)24 7671 8970
To register your place as a delegate, visit: https://csinternational.net/register
Register
