News Article
Temescal sponsor CS International Conference in Frankfurt
Temescal have confirmed they will be platinum sponsors at the Compound Semiconductor industry's premier international event, CS International, which will held in Frankfurt, Germany on 4h & 5th March 2013.
For over fourty years, Temescal has been at the forefront of electron beam coating and the design and manufacture of systems and components for precision deposition. Today, their industry leading evaporation systems are recognized as the premier solution for the most demanding metalization applications.
Today the world's most sophisticated HB-LED lighting, wireless, ophthalmic lens, triple junction PV solar, precision optic and telecom sub-systems rely on millions of devices that are made using Temescal deposition systems and components.
The must attend event for 2013 is the third CS International conference in Frankfurt, Germany, where delegates will gain a comprehensive overview of the entire compound semiconductor industry.
Professionals from around the world will attend this two-day event to hear key insights and opportunities, from a range of leading analysts, and learn of the latest chip developments in LEDs, solar cells, lasers and power and RF electronics.
Delegates will get the opportunity to network with leading industry professionals of the III-V chip making industry and interact with suppliers.
Industry leaders from Intel, Cree, Epistar, RFMD, TriQuint and over 20 other leading chipmakers will also be present and to share their perspective on the latest developments in device technology.
A Networking Conference Dinner will be held on the evening of the 4th March where the industry will recognise the success and development along the entire value chain of the Compound Semiconductor industry from research to completed device, focusing on the people, processes and products that drive the industry forward through The CS Industry Awards 2013.
Further information on the conference and the awards is available on the CS International website at: www.cs-international.net
Registration is now open for 2013 event. Delegates who book before October 31st 2012 can take advantage of our early bird rate, saving of €57.
Connecting the Compound Semiconductor Industry
The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.
Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.
To discover our sponsorship and exhibition opportunities, contact us at:
Email: info@csinternational.net
Phone: +44 (0)24 7671 8970
To register your place as a delegate, visit: https://csinternational.net/register
Register
The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.
Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.
To discover our sponsorship and exhibition opportunities, contact us at:
Email: info@csinternational.net
Phone: +44 (0)24 7671 8970
To register your place as a delegate, visit: https://csinternational.net/register
Register
