News Article
Toshiba reveals ultra-small chip white LEDs
The compact scale GaN-on-silicon package is claimed to reduce mounting area by 90 percent
Toshiba Corporation has announced the launch of ultra-small chip scale package white LEDs for lighting applications.
The company claims the device can reduce the mounting area by 90 percent compared to conventional 3.0 x 1.4 mm package products. This is according to a Toshiba survey.
The new TL1WK series will start sample shipment from April.
TL1WK LED
The new products utilise GaN-on-silicon process technology and a new process technology that fabricates the elements of a packaged LED on an 8-inch silicon wafer. The LEDs are claimed to be the industry’s smallest in sub-watt class (1/4-1/2W) white LEDs as of a March 27th, 2014 Toshiba survey.
The package size is 0.65 x 0.65mm, and the LED achieves a luminous efficacy of 130lm/W during 60mA operation and superior heat dissipation. Using the new white LEDs makes it possible to achieve a narrow beam in small-size lighting equipments and can contribute to innovation in lighting design.
The new white LEDs will be showcased at “Light+Building”, a trade fair for lighting and architecture in Frankfurt, Germany from March 30th to April 4th.
Applications of the LED includes light sources for general lighting, including straight tube lights, light bulbs and ceiling lights.
The colour temperature is 5000K, the colour rendering Index (Ra) is 80 (Min) while the forward current is 180mA (Max).
Colour variations under planning for 4000K, 3000K and 2700K.
The company claims the device can reduce the mounting area by 90 percent compared to conventional 3.0 x 1.4 mm package products. This is according to a Toshiba survey.
The new TL1WK series will start sample shipment from April.
TL1WK LED
The new products utilise GaN-on-silicon process technology and a new process technology that fabricates the elements of a packaged LED on an 8-inch silicon wafer. The LEDs are claimed to be the industry’s smallest in sub-watt class (1/4-1/2W) white LEDs as of a March 27th, 2014 Toshiba survey.
The package size is 0.65 x 0.65mm, and the LED achieves a luminous efficacy of 130lm/W during 60mA operation and superior heat dissipation. Using the new white LEDs makes it possible to achieve a narrow beam in small-size lighting equipments and can contribute to innovation in lighting design.
The new white LEDs will be showcased at “Light+Building”, a trade fair for lighting and architecture in Frankfurt, Germany from March 30th to April 4th.
Applications of the LED includes light sources for general lighting, including straight tube lights, light bulbs and ceiling lights.
The colour temperature is 5000K, the colour rendering Index (Ra) is 80 (Min) while the forward current is 180mA (Max).
Colour variations under planning for 4000K, 3000K and 2700K.
Connecting the Compound Semiconductor Industry
The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.
Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.
To discover our sponsorship and exhibition opportunities, contact us at:
Email: info@csinternational.net
Phone: +44 (0)24 7671 8970
To register your place as a delegate, visit: https://csinternational.net/register
Register
The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.
Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.
To discover our sponsorship and exhibition opportunities, contact us at:
Email: info@csinternational.net
Phone: +44 (0)24 7671 8970
To register your place as a delegate, visit: https://csinternational.net/register
Register
