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Toshiba reveals ultra-small chip white LEDs

The compact scale GaN-on-silicon package is claimed to reduce mounting area by 90 percent
Toshiba Corporation has announced the launch of ultra-small chip scale package white LEDs for lighting applications.

The company claims the device can reduce the mounting area by 90 percent compared to conventional 3.0 x 1.4 mm package products. This is according to a Toshiba survey.

The new TL1WK series will start sample shipment from April.


The new products utilise GaN-on-silicon process technology and a new process technology that fabricates the elements of a packaged LED on an 8-inch silicon wafer. The LEDs are claimed to be the industry’s smallest in sub-watt class (1/4-1/2W) white LEDs as of a March 27th, 2014 Toshiba survey.

The package size is 0.65 x 0.65mm, and the  LED achieves a luminous efficacy of 130lm/W during 60mA operation and superior heat dissipation. Using the new white LEDs makes it possible to achieve a narrow beam in small-size lighting equipments and can contribute to innovation in lighting design.

The new white LEDs will be showcased at “Light+Building”, a trade fair for lighting and architecture in Frankfurt, Germany from March 30th to April 4th.

Applications of the LED includes light sources for general lighting, including straight tube lights, light bulbs and ceiling lights.

The colour temperature is 5000K, the colour rendering Index (Ra) is 80 (Min) while the forward current is 180mA (Max).

Colour variations under planning for 4000K, 3000K and  2700K.


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