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Flip Chip LED packaging growing in popularity

By 2020 market share will reach 24 percent says Yole

The winds of change are blowing in the LED packaging world, according to market analysis firm Yole Developpement. An LED TV crisis, and new Chinese players have modified the LED industry and its supply chain -  the result, says Yole, is that companies need to innovate with new solutions such as Flip Chip LED packaging.

In 2013, LEDs based on Flip Chip technology represented 11 percent (in volume) of the overall high power LED market. By 2020, market share should reach 24 percent, says Pars Mukish, senior market and technology analyst, LED, OLED & Compound Semiconductors, at Yole (Source: LED Packaging 2014 report, to be released end of  September 2014).

Pars Mukish will present Yole's latest analysis, with a special focus on LED chip manufacturing and packaging, at the end of September at the 4th International LED professional Symposium +Expo (LpS 2014) which will take place in Bregenz, Austria. The symposium is a three day event for industrials and researchers involved in LED design and engineering.

During his presentation, Mukish will highlight the recent developments dedicated to LED chip manufacturing and packaging, main market trends, emerging technologies and technical challenges including packaging process steps and supply chain.

All these results are part of two technology & market reports 'LED Front End Manufacturing Trends' (released in May 2014) and 'LED Packaging' that will be released end of September 2014.

Connecting the Compound Semiconductor Industry

The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.

Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.

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