+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

Packaged LED lighting reached $6.6 billion in 2014

Mid- to low-power LEDs generated 70 percent revenue share, according to IHS

Packaged LED lighting revenue reached $6.6 billion in 2014. Nearly three quarters (70 percent) of that revenue was generated from mid- to low-power LED sales, according to the latest data in the Packaged LED Report 2015, a part of IHS LED Intelligence Service.

The chip-on-board (COB) share was only 8 percent, despite the fact that only a small number of companies began promoting COB products just a few years ago. Citizen was the largest provider last year, with approximately 20 percent market share; followed by Cree, with a 15 percent. The COB market is forecast to increase at a compound annual growth rate (CAGR) of 20 percent, from 2014 to 2020, as they are used to replace high-power LEDs in outdoor lighting applications. The high-end commercial market also shows potential for COB.

The high power LED market is still dominated by several international companies, including Cree, Lumileds, and Osram. In fact, the top three suppliers combined comprised 65 percent of the LED market in 2014.

Nichia led in the mid- to low-power LED market, followed by Seoul Semiconductor and Samsung. The mid- to low-power LED market is much more fragmented, due to the number of Chinese companies competing in this market. 

The largest Chinese packaged LED company, MLS, boasted 5 percent share of the market last year, following Samsung. Mid-power LED is more cost effective for indoor lighting and, with technology improvements, this category might also compete with high power LEDs in the future. 


Connecting the Compound Semiconductor Industry

The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.

Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.

To discover our sponsorship and exhibition opportunities, contact us at:

Email: info@csinternational.net
Phone: +44 (0)24 7671 8970

To register your place as a delegate, visit: https://csinternational.net/register

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: