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Disco To Exhibit Automatic Polisher

Fully automatic machine supports difficult-to-process materials including sapphire and SiC

Tokyo-based Disco Corporation has developed a fully-automatic polisher which supports CMP (chemical mechanical polishing) of difficult-to-process and small-diameter materials (8 inches and less) including sapphire, SiC, LiTaO3, and LiNbO3.

DFP8141 will be on display at SEMICON Japan 2016 (December 14 - 16 at Tokyo Big Sight).

The high-intensity LED market requires a polishing process for device performance improvement after the backside grinding of the sapphire substrate on which the semiconductor device has been formed. With the increase in demand for saving energy, the need to polish SiC for power devices, LiTaO3 for SAW filters, and LiNbO3 has been increasing too.

According to Disco, the DFP8141 is a fully-automatic single-spindle polisher which offers processing solutions which were not available through the company's lineup until now. 

Features include a fully-automatic specification which completes CMP processing cassette-to-cassette: DFP8141 comes equipped with a cleaning station and performs wafer cleaning and drying after processing automatically.

As well as the standard fully-automatic specification, the design of DFP814 allows for various types of specifications, including the semi-automatic specification which has no transfer section, and the in-line specification for seamless processing with the DFG8830 grinder for difficult-to-process materials.

The transfer system accepts three types of workpiece configurations: single wafer transfer, substrate transfer, and frame transfer. It has a single spindle with two chuck tables, single wafer processing. 



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