News Article

ClassOne Reports Record Quarter

More than Moore technologies and wafer-level packaging boost sales

ClassOne Technology, a manufacturer of cost-efficient wet processing equipment for ≤200mm substrates has reported its best-ever sales quarter and is currently doubling its Kalispell manufacturing capacity to meet the demand.

"We've been seeing a steady increase in market interest and sales," said president, Kevin Witt. "Most of these users are now focusing on capabilities they couldn't get before, like wafer-level packaging and More than Moore technologies."

Witt explained that wafer-level packaging (WLP) has been used for some time with 300mm and larger substrates - but the equipment has not been available for 200mm. "Fortunately, ClassOne focuses specifically on the smaller-wafer markets," said Witt. "At a very affordable price, we deliver the new technology and advanced 3D features they're looking for. For example, our Solstice line of multifunctional electroplating systems enables high-efficiency Cu Through Silicon Via (TSV), Pillar, Bump and Barrier Plating and other capabilities that WLP requires. And that's one major reason they're coming to us."

ClassOne reports that many of the new buyers are keenly interested in More than Moore (MtM) technologies to increase functionality while reducing cost per device. They are producing compound semiconductors, LEDs, MEMS, RF, Wi-Fi and a range of IoT-related sensors and other devices.

ClassOne cites the combination of ≤200mm-specific tools, advanced capabilities and affordable pricing as the primary driver behind the current equipment-buying surge in emerging markets.

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