Molex High-speed High-density Technologies Showcased At OFC 2017
Molex spotlighting integrated high-speed, high-density connectivity solutions at OFC between 19-23 March 2017 at LA Convention Center
At OFC 2017, Molex is featuring next-generation technologies designed for demanding data communications and networking infrastructure, including:
- High-density optical EMI shielding adapters designed to ease space constraints in applications requiring I/O density and EMI containment. Featuring streamlined behind-panel fibre routing and eye protection, these adapters support a variety of connector types including MXC, MTP/MPO, MT, and HBMT.
- BiPass™ I/O and Backplane Cable Assemblies combine QSFP+Â®, Impel™ or near-ASIC connectors with thin Twinax cables to provide a low-insertion-loss alternative to PCB traces for high bandwidth speeds, efficiency and thermal management of densely packed circuits in 56 Gbps PAM4, 56 Gbps NRZ, and 112 Gbps PAM4 applications in data communications, telecom and networking infrastructure.
Molex industry experts will present as well as host industry meetings and workshops at OFC 2017.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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