Device Design And Packaging Award
ENTRY: RF Fusion Portfolio
Makers of flagship smartphones seek to squeeze the highest levels of functionality and performance into ultra-slim handsets. Because these high-end phones are designed for global or super-regional use they also need to integrate support for many different regional LTE bands as well as multiple carrier aggregation (CA) band combinations.
The RF Fusion portfolio of solutions from Qorvo contains multiple high-performance modules focused on differentiated performance "“ achieved by integrating Qorvo's leading technologies such as NoDrift and LowDrift filters along with advanced power amplifier (PA) and switch technologies. All delivered in the industry's smallest form factors.
Qorvo's RF Fusion provides OEMs with a complete RF Front End (RFFE) solution that incorporates all major transmit and receive functionality including support for major frequency bands into three compact modules covering the high-band, mid-band and low-band regions of the spectrum. The architecture is also designed to integrate support for the rapid deployment of CA in markets worldwide.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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