Info
Info

UK Team Develops Novel Spectroscopy Technique

News

X-ray photoelectron spectroscopy has the potential to become an important technique in compound semiconductor quality control

A novel use of X-ray photoelectron spectroscopy (XPS) is being pioneered by physicists at Lancaster University working with technology firm Kratos Analytical.

XPS has the potential to become an important technique in the development and production quality control of compound semiconductor devices such as VCSELs, according to the researchers.

Manus Hayne from Lancaster University's Department of Physics said: "XPS is used almost exclusively on surfaces as it has an extremely small penetration depth into the material of only a few atomic layers.

"However, by slowly and carefully etching the material in situ in the XPS machine we have shown that the technique can be applied to allow the accurate determination of the elemental composition of compound semiconductor materials with multiple layers of different alloys."

The ability to engineer the electronic and optical properties of compound semiconductors, for example in terms of their alloy composition, and grow multiple layers of different semiconductors on top of each other (heterostructures), is a key part of their success.

Hayne's work with Kratos is an offshoot of his QR-SPLED project, funded through Innovate UK and the Engineering and Physical Sciences Research Council (EPSRC), in the framework of the UK National Quantum Technologies Programme.

The project is assessing the feasibility of mass-producing low-cost, single-photon sources in the form of single-photon light emitting diodes (SPLEDs), by exploiting the unique properties of semiconductor nanostructures called self-assembled quantum rings. It follows on from a recent project in which Hayne and collaborators demonstrated novel quantum-ring VCSELs.

Hayne is a world authority on self-assembled GaSb/GaAs quantum rings and their use in devices such as telecoms-wavelength VCSELs.

3D Imaging Technique Unlocks Perovskite Properties
Mitsubishi And University Of Tokyo Collaborate To Enhance Reliability Of SiC Devices
Mobile 5G To Be Commercially Launched In MENA In 2019
Automotive Lighting: New SSL Technologies Integration Is Transforming The Industry
Infinera Expands Open Optical Networking Capabilities
POET Grows Q3 Revenue 20 Percent
European InP PIC Pilot Project Takes Off
Philips Photonics Reaches One Billion VCSEL Shipment Milestone Due To Growth In Smartphone 3D Sensing Applications
Imec Grows 2D Materials On 300mm Wafers
Lumileds Launches New Plant Growth LEDS
New Ultra Wideband 0.5W GaAs Distributed Driver Amplifier Operates From DC - 30 GHz With High Linearity
CST Global Launches Photonics Forum
OSA Opto Develops High Performance UVC LED Module
Nitride Semiconductor Enters Micro-LED Display Market
DISCO Announces 8inch Wafer Grinder
Transphorm’s High Voltage GaN Helps Inergy Disrupt The Solar Power Generator Market
AquiSense Technologies Announces R&D Agreement With US EPA And Washington University For UV LED Disinfection Development
Heterostructure Photodiode On An InAs Substrate
Marktech Optoelectronics Announces Multi-wavelength Emitters, Detectors And LEDs For Wearables
Complete Electronics Package For Initial Tests And Test Series
Selectronic And Hongli Zhuihui Forge $75m LED Deal
EV Group Unveils Next-Generation Fusion Wafer Bonder
GEIC Expands 2D Materials Partnerships
CST Global Appoints Dr. Tiina Delmonte As R And D Programme Manager

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info