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StratEdge To Exhibit GaN And GaAs Packages

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Company to exhibit high-frequency, high-speed, thermally efficient packages at IMAPS, BCICTS, and EDI CON USA

StratEdge, a maker of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, will display its high-frequency, high-speed, thermally efficient packages at IMAPS, BCICTS, and EDI CON USA.

StratEdge's packages meet the extreme demands of GaN and GaAs devices and the critical requirements of the telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS markets.

"Since StratEdge started manufacturing packages for semiconductor devices in 1992, we have seen the demand for high-speed, high-frequency, data-intensive technologies multiply. This is reflected in the interest in these events."

StratEdge will showcase two options for packaging GaN and high-power semiconductor devices, the LL family of leaded laminate copper-moly-copper (CMC) base packages and its off-the-shelf line of molded ceramic packages that can be configured to meet the requirements for chips with frequencies up to 18 GHz. These packages dissipate heat and come in fully-hermetic versions in over 200 standard outlines.

StratEdge will also feature its complete line of post-fired and molded ceramic semiconductor packages operating from DC to 63+ GHz. These packages have electrical transition designs that ensure exceptionally low electrical losses and operate efficiently, even at the highest frequencies. All packages are lead-free and most meet RoHS and WEEE standards.

"We are excited to participate in these three industry events," said Tim Going, president of StratEdge. "Since StratEdge started manufacturing packages for semiconductor devices in 1992, we have seen the demand for high-speed, high-frequency, data-intensive technologies multiply. This is reflected in the interest in these events."

StratEdge will be exhibiting at the 2018 IMAPS Symposium on Microelectronics, held October 9-11, 2018 at the Pasadena Convention Center in Pasadena, It will also be at the 2018 IEEE BiCMOS and Compound Integrated Circuits and Technology Symposium (BCICTS), October 14-17, 2018 at the Sheraton San Diego Hotel and Marina in San Diego, California. It will also be at EDI CON USA 2018 at the Santa Clara Convention Center, Santa Clara, CA from October 17-18, 2018.


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