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Oxford Instruments And ULVAC Collaborate On WBG Production

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Companies to bring atomic scale processing solutions to the Japanese power and RF markets

UK-based firm Oxford Instruments Plasma Technology and Japanese company ULVAC are collaborating to bring leading edge deposition and etch technology solutions to GaN and SiC based Wide Band Gap production customers in Japan.

“Oxford Instruments Plasma Technology is excited to be collaborating with ULVAC in order to bring its proven process solutions to the Japanese power and RF markets”, commented Mike Gansser-Potts, managing director, Oxford Instruments Plasma Technology. “This relationship, which will begin with ULVAC as our channel partner in Japan, will allow local production customers access to Oxford Instruments' suite of Atomic Scale Processing solutions”

“This is indeed a very significant collaboration”, confirmed Tetsuya Shimada, general manager for Advanced Electronics Equipment Division of ULVAC. “Our new collaborator, Oxford Instruments Plasma Technology, has critical process technology and know-how which complements our own capabilities. Combined with our customer support infrastructure this will allow us to provide a complete solution to our Japanese customers.”

Oxford Instruments says its Atomic Layer Deposition (ALD) and Atomic Layer Etch (ALE) are critical process steps for GaN and SiC based devices to enable functionality and reliable device manufacturing.


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