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II-VI To Supply SiC Substrates Under EU Horizon Project

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REACTION program aims to establish world’s first 200 mm SiC pilot line for power electronics

II‐VI, a provider of SiC substrates for power electronics, will supply 200 mm SiC substrates under REACTION, a Horizon 2020 four year program funded by the European Commission.

The goal of the Horizon 2020 program is to establish in Europe the world's first 200 mm pilot production facility for power electronics based on SiC, an advancement from today's standard of 150 mm. Through this program, the European Commission is investing in the capabilities required to scale up production of SiC-based power electronics. SiC achieves superior efficiency, higher energy density and lower system-level cost per watt. Power electronics based on SiC have demonstrated their potential to have a highly-beneficial impact on the environment via significant reductions in carbon-dioxide emissions.

“II-VI introduced the world's first 200 mm SiC substrates in 2015,” said Martin Benzing, managing director, II-VI GmbH. “The strength of II-VI's technology platform is based on a strong portfolio of 30 active patents and on highly differentiated and proprietary manufacturing platforms and technologies.”

Participants in this Horizon 2020 program represent the entire value chain for power electronics. The mission is to demonstrate the possibility of scaling the mass production of 200 mm substrates for SiC devices in power applications ranging from 600 V to 3.3 kV. The ultimate goal is to achieve the cost, performance and size requirements that will enable their broad adoption in emerging clean technology applications, including in electric cars, renewable energy systems and smart power grids.



CS International 26-27 March 2019, Sheraton Airport Hotel, Brussels

In its ninth year, CS International will continue to provide timely, comprehensive coverage of every important sector within the compound semiconductor industry. Presentations are split into 5 key themes and each industry key theme will be delivered by a keynote presentation from a leading industry figure as well as a market analyst presentation tailored to the theme. Together, the talks will detail breakthroughs in device technology; offer insights into the current status and the evolution of compound semiconductor devices; and provide details of advances in tools and processes that will help to drive up fab yields and throughputs. Attendees at the two-day conference will gain an up-to-date overview of the status of the CS industry, and have opportunities to meet many other key players within this community.

Places will be limited, so register your place today: https://cs-international.net

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