Info
Info

Macom Expands 400G PAM-4 Chipset Solution

News

New MATA-03820 and MATA-03819 TIAs deliver very low noise performance while supporting bandwidth up to 35 GHz

Macom Technology has announced availability of production versions of its four-channel (4 x 100G) 56/106 Gbit PAM-4 linear transimpedance amplifiers (TIAs) optimised for use in 400G optical modules targeting cloud data centre applications.

The new MATA-03820 and the MATA-03819 are available in flip chip and wire bonding packaging options, respectively, for deployment in single-lambda 400G-FR4 and DR4 format QSFP-DD and OSFP optical modules.

Delivering low noise performance less than 1.5 uA RMS typical and supporting bandwidth up to 35 GHz, Macom's MATA-03820 and MATA-03819 TIA family supports high throughput optical data links in a very low power profile, optimal for use in high density optical data centre interconnects, according to the company.

Features include RSSI for photo-alignment and power monitoring, and I2C management interface for control of bandwidth, output amplitude, peaking, loss of signal (LOS), gain and other key parameters.

“Molex is excited to collaborate with Macom. Leveraging Macom's technical support along with its broad portfolio of TIAs we are able to ensure the availability of industry leading 400G optical modules,” said Adit Narasimha, VP and general manager, Molex Optoelectronics. “The low noise performance of Macom's TIA along with its flexible programmability, enable delivery of industry leading low bit error performance when implemented with a DSP for 400G modules.”

“In the rapid evolution to single fibre 100G and parallel fibre 200G and 400G connectivity, we believe that Macom has again affirmed its leadership position in delivering the high-performance, power-efficient optical components needed to maximize bandwidth density in the Cloud Data centre,” said Marek Tlalka, senior director of marketing, high-performance analog, Macom. “Macom's MATA-03820 and MATA-03819 TIA family, complemented by a comprehensive portfolio of seamlessly-interoperable Macom components, is helping our customers accelerate this transition.”

Macom will be hosting demonstrations of the expanded PAM-4 chipset for 100G, 200G and 400G applications at OFC 2019, featuring the MATA-03820 and MATA-03819 TIAs in customer module implementations and a live 200G/400G ROSA demonstration.



CS International 26-27 March 2019, Sheraton Airport Hotel, Brussels

In its ninth year, CS International will continue to provide timely, comprehensive coverage of every important sector within the compound semiconductor industry. Presentations are split into 5 key themes and each industry key theme will be delivered by a keynote presentation from a leading industry figure as well as a market analyst presentation tailored to the theme. Together, the talks will detail breakthroughs in device technology; offer insights into the current status and the evolution of compound semiconductor devices; and provide details of advances in tools and processes that will help to drive up fab yields and throughputs. Attendees at the two-day conference will gain an up-to-date overview of the status of the CS industry, and have opportunities to meet many other key players within this community.

Places will be limited, so register your place today: https://cs-international.net

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info