Loading...
News Article

SweGaN moves HQ and announces new GaN-on-SiC epiwafer

News

Company aligns production capacity and capability to meet customers needs for 5G networks, defence radars and satellite communication

SweGaN AB, manufacturer of GaN-on-SiC epitaxial wafers for telecom, satellite, defence and power applications, has relocated its HQ to a new facility in Linköping, Sweden.

“The facility is a huge contrast from our previous cramped quarters” states Olof Kordina, CEO of SweGaN. The lab area has incredibly robust 1-metre thick walls and is hence, lovingly called the bunker”, continues Olof Kordina. The bunker houses SweGaN’s main operational offices and a lab for production and R&D. “

Concurrently, SweGaN has introduced a 150mm (6 inch) QuanFINE GaN-on-SiC epiwafers to its product portfolio for RF and high-power switching devices. The 150mm epiwafers will boost the manufacturing capacity of GaN-on-SiC RF devices for various applications. ”The new QuanFINE 150mm epiwafers are mass-produced in our new high-capacity reactor,” says Kordina.

The simplified QuanFINE heterostructure is said to provide superior electrical and thermal properties including low current dispersion, excellent heat dissipation and high breakdown performance, to ensure the best long-term return-on-investment for customer product development for RF and power applications.

”Our new product signals that SweGaN is aligning its production capacity and capability closely with our customers’ needs for the rapidly expanding 5G networks, defence radars and satellite communication, said Jr-Tai Chen, CTO at SweGaN AB. The 150mm QuanFINE product will also facilitate the development of high-end GaN power devices, where price–performance ratio and reliability are critical elements for our customers. ”

Highlighting that device manufacturers typically execute over 100 steps during the fabrication of a device, a larger epiwafer - in simple terms - means manufacturers can produce more devices in the same cycle time, creating clear benefits for return-on-investment.

SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
SemiQ launches hi-rel 1700V SiC MOSFETs
Lynred to exhibit Eyesential SWIR sensor for machine vision
Thorlabs buys VCSEL firm Praevium Research
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: