News Article

Electrically Injected GeSn Laser Makes Its Debut

News

Breakthrough laser operates in pulsed conditions up to 100 kelvins

US-based materials science researchers, led by electrical engineering professor Shui-Qing 'Fisher' Yu, have demonstrated what they claim is the first electrically injected laser made with GeSn. Used as a semiconducting material for circuits on electronic devices, the diode laser could improve micro-processing speed and efficiency at much lower costs.

In tests, the laser operated in pulsed conditions up to 100 kelvins.

"Our results are a major advance for group-IV-based lasers," Yu said. "They could serve as the promising route for laser integration on silicon and a major step toward significantly improving circuits for electronics devices."

The research is sponsored by the Air Force Office of Scientific Research, and the findings have been published in Optica, the journal of The Optical Society. Yiyin Zhou, a U of A doctoral student in the microelectronics-photonics program authored the article. Zhou and Yu worked with colleagues at several institutions, including Arizona State University, the University of Massachusetts Boston, Dartmouth College in New Hampshire and Wilkes University in Pennsylvania. The researchers also collaborated with Arktonics, an Arkansas semiconductor equipment manufacturer.

The alloy GeSn is a promising semiconducting material that can be easily integrated into electronic circuits, such as those found in computer chips and sensors. The material could lead to the development of low-cost, lightweight, compact and low power-consuming electronic components that use light for information transmission and sensing.

Yu has worked with GeSn for many years. Researchers in his laboratory have demonstrated the material's efficacy as a powerful semiconducting alloy. After reporting the fabrication of a first-generation, optically pumped laser, Yu and researchers in his laboratory continue to refine the material.

CS International to return to Brussels – bigger and better than ever!


The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.


Join us face-to-face between 28th – 29th June 2022

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
  • Email info@csinternational.net  or call +44 (0)24 7671 8970 for more details.

*90% of exhibition space has gone - book your booth before it’s too late!

Register


×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
{megaLeaderboard}
X
{normalLeaderboard}
Live Event