ECOC 2021: Trumpf To Show New Generation Of Datacom Products
Extended temperature range VCSELs and photodiodes benefit from upgraded manufacturing platform
Trumpf Photonic Components, a German VCSEL and photodiode manufacturer, will show new products for datacom at European Conference on Optical Communication (ECOC) in Bordeaux, France (September 13th -16th 2021).
The company has a new generation of VCSELs and photodiodes which it says have superior performance at higher temperatures thanks to an extensively upgraded manufacturing platform with enhanced process control and better yields.
The VCSELs feature fully passivated die and extra mechanical protection for enhanced reliability. The matching photodiode has low dark current and additional ground pad for better shielding which also provides ground-signal or signal-ground options for mounting.
These features are designed to save costs for its data centre and high-performance computing customers not only from the reduced energy cost from less cooling, but also from less device related failures in the field.
“With our strong heritage in VCSEL and photodiode technology, we are continuously working to push the boundaries of what is possible,” said Ralph Gudde VP of marketing and sales. “While we are pleased to offer expanded temperature range on our devices up to 56Gbps today, we are now focusing on bringing our 112Gbps solutions to the market early next year, with first samples targeted for December 2021,” he added. Next to the data communication market, the company also offers solutions for consumer electronics, industrial sensing and industrial heating markets.
Trumpf will be demonstrating its 56Gbps VCSEL and photodiode functioning as a link in collaboration with transimpedance amplifier (TIA) and VCSEL driver at ECOC in Bordeaux, France.
The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.
Join us face-to-face between 28th – 29th June 2022
- View the agenda.
- 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
- Email info@csinternational.net or call +44 (0)24 7671 8970 for more details.
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