Indium Introduces AuSn Pastes For High-Power LEDs
AuLTRA 3.2 and AuLTRA 5.1 are formulated to accommodate higher processing temperatures while providing high reliability
Indium Corporation has expanded its portfolio with two new AuSn pastes designed for the higher processing temperatures and assembly needs required for use in high-power LED module array applications, such as automotive, infrastructure, and horticulture.
High-power LEDs last longer and provide much higher levels of light output than traditional LEDs. Due to the large amount of heat generated—in such a localised area—a high-melting and high-reliability solder is required for assembly.
It is also critical to the LED assembly process that the solder interface between the diode and its substrate is void-free in order to generate a stable transmission of light and allow for the transfer of the tremendous heat generated by the diodes to maintain the temperature stability of the device.
AuLTRA 3.2 and AuLTRA 5.1 are AuSn solder pastes specifically formulated to accommodate higher processing temperatures while providing high reliability. AuLTRA 3.2 offers: water-soluble flux, air or nitrogen reflow, good wetting, low-voiding, and long open life/reduced waste. AuLTRA 5.1 offers: no-clean residue, air or nitrogen reflow, good wetting, low-voiding, and long open life/reduced waste.
Both pastes are offered in a variety of AuSn alloys and powder sizes. In addition to being suitable for use in high-power LED module array applications, AuLTRA 3.2 and AuLTRA 5.1 are applicable for all AuSn paste applications as their performance has been, and continues to be, proven in the field.