Kopin Announces High Performance HBT Transistors from New, Multiple 6-Inch Wafer Platform

December 15 , 1999

Taunton, MA. Kopin Corporation (NASDAQ:KOPN), the leading provider of gallium arsenide (GaAs) HBT transistors for the wireless and fiberline telecommunications market, today announced that it has commenced shipping 6-inch InGaP and AlGaAs HBT transistor wafers from its new, high volume production systems. This new production platform provides high volume support for 6-inch telecom circuit production programs that begin next year. Two such new systems are presently in place at Kopin and additional systems are scheduled for installation in 2000.

Kopin s proprietary high performance HBT transistors are used to produce circuits for CDMA, TDMA and GSM digital PCS handsets, as well as for the upcoming third generation (3G) digital wireless standard. Kopin s HBT transistor wafers are also used for circuits for broadband OC-48/OC-192 SONET systems, which form the backbone of the highest speed fiber optic networks.

"The ability to provide a portfolio of high quality 6-inch HBT transistor wafer products in high volume is a significant milestone for Kopin and the industry," stated Dr. John C.C. Fan, Kopin s President and Chief Executive Officer. "This accomplishment enables our HBT circuit partners to support the explosive market demand for advanced telecom circuits by aggressively moving to 6-inch production in 2000. The 6-inch wafers provide significant benefits to our partners in cost, yield, volume, capacity and the wider availability of 6-inch circuit processing equipment."

"Kopin can now produce five 6-inch HBT transistor wafers per run instead of producing these transistors one wafer at a time," Fan continued. "Transistor performance results on 6-inch wafers from our new platform are comparable to the high performance transistors we provide from our high volume, multiple 4-inch wafer platform."

"Kopin continues to bring on-line new HBT products such as our 6-inch InGaP and AlGaAs transistor wafers and new production capacity at an unprecedented rate," said Daily S. Hill, Kopin s Vice President of GaAs Operations. "Our capacity expansion is proceeding smoothly and on schedule. Throughout the second half of 1999, we have demonstrated that we can bring on-line high volume 4-inch systems in an efficient, modular fashion. Meanwhile we have transferred our proprietary HBT processes to a larger platform capable of providing multiple 6-inch transistor wafers per run with consistently excellent physical and transistor characteristics. The larger platform gives Kopin the flexibility to quickly respond to either 4-inch or 6-inch market demand."

"We are presently installing production capacity at a rate of a new system per month," Hill continued. "New installations will continue into 2000 as Kopin expands its infrastructure build out for the exploding wireless and fiberline markets."

About Kopin

Kopin Corporation is a leading manufacturer of gallium arsenide transistor products and miniature flat panel displays for wireless communications and digital imaging applications. The Company s GaAs heterojunction bipolar transistor (HBT) devices are used to produce power amplifier circuits for wireless telephone handsets and gigabit circuits for fiber optic and Internet data transmission. Kopin s CyberDisplay family of ultra-small, high density imaging devices is designed for portable communication and consumer products including camcorders, digital cameras and wireless Internet appliances. Kopin s Web site is located at www.kopin.com.

CyberDisplay is a trademark of Kopin.

Forward-looking statements contained in this press release are made under safe harbor provisions of the Private Securities Litigation Reform Act of 1995 and involve a number of risks and uncertainties that could materially affect future results. Among these risk factors are general economic and business conditions and growth in the flat panel display and gallium arsenide integrated circuit and materials industries, the impact of competitive products and pricing, availability of third-party components, availability of integrated circuit fabrication facilities, the Company s ability to successfully expand its production facilities, cost and yields associated with production of the Company s CyberDisplay imaging devices and HBT transistor wafers, loss of significant customers, acceptance of the Company s products, continuation of strategic relationships, year 2000 matters, and the other risk factors and cautionary statements listed from time to time in the Company s periodic reports and registration statements filed with the Securities and Exchange Commission, including but not limited to, the Company s Annual Report on Form 10-K for the fiscal year ended December 31, 1998.

Contact: Kopin Corporation Matthew Micci, VP, Sales & Mktg. Richard Sneider, CFO Tel: (508) 824-6696 mmicci@kopin.com, rsneider@kopin.com or Sharon Merrill Associates, Inc. Scott Solomon Tel: (617) 542-5300 ssolomon@sharonmerrillassoc.com