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Agilent Technologies Plans Six-Inch Wafer Production FAB for Breakthrough E-pHEMT Process

Source: Agilent Technologies

Agilent Plans to Produce CDMA and GSM Handset Power Amplifiers in Fort Collins, Colo.

Palo Alto, CA. Agilent Technologies Inc. (NYSE: A) today announced plans for a six-inch wafer fabrication line in its Ft. Collins, Colo. facility to produce E-pHEMT-based power products for CDMA, GSM and 3G mobile handsets.

The first phase of the project will include 15,000 square feet of cleanroom, and Agilent will have the option to expand to 45,000 square feet in the existing Class 100 (fewer than 100 particles larger than 0.5 micron per cubic foot) cleanroom facility. Agilent plans to create "mini-environments" within the larger cleanroom that will achieve particle levels better than Class 1 (fewer than 1 particles larger than 0.5 micron per cubic foot) in order to realize very high quality and yields. The first phase of the fab is planned to be in full production by the end of 2002, and is expected to initially produce 48,000 six-inch wafers per year. Until the new fab goes into production, Agilent plans to produce E-pHEMT devices in its Santa Clara, Calif. facility.

"This fab will allow us to keep pace with the large demand that we anticipate for our high-efficiency handset power modules, based on initial customer interaction," said Dave Allen, vice president and general manager of Agilent s Wireless Semiconductor Division. "The Ft. Collins facility was a logical choice because our existing high-volume silicon fab facilities and experienced talent pool will allow us to quickly ramp this new process."

About E-pHEMT

E-pHEMT (enhancement-mode pseudomorphic high-electron-mobility transistor) is a breakthrough power semiconductor process optimized for wireless applications. All current gallium arsenide (GaAs), metal-semiconductor field effect transistor (MESFET) and high-electron-mobility transistor (HEMT) devices operate from a positive voltage supply, but need a negative voltage polarity to switch them on. The components to provide the second polarity increase system cost, take up valuable board space and require extra design effort. E-pHEMT technology, which requires only a single positive power supply, promises power-amplifier modules that will improve CDMA mobile phone battery life by up to 15 percent, or allow smaller batteries that will make room for new features.

Further information on Agilent s RF semiconductor products may be found on the Web at www.agilent.com/view/rf/.

About Agilent Technologies

Agilent Technologies Inc. (NYSE: A) is a diversified technology company with approximately 46,000 employees serving customers in more than 120 countries. Agilent is a global leader in designing and manufacturing test, measurement and monitoring instruments, systems and solutions, and semiconductor and optical components. In fiscal year 1999, Agilent had net revenue of more than $8.3 billion. The company serves markets that include communications, electronics, life sciences and healthcare.

Information about Agilent Technologies can be found on the Web at www.agilent.com. This news release contains forward-looking statements including, without limitation, statements relating to Agilent s plans to build fab lines to increase wafer production, that involve risks and uncertainties that could cause results of Agilent Technologies to differ materially from management s current expectations. These risks are detailed in Agilent s Annual Report on Form 10-K for the year ended October 31, 1999, and its Quarterly Report on Form 10-Q for the quarter ended July 31, 2000, as filed with the Securities and Exchange Commission.

Contact: Agilent Technologies Don Parkman Tel: 408/654-8794 don_parkman@agilent.com

 

Agilent Technologies
Don Parkman
Tel: 408/654-8794
don_parkman@agilent.com
 
E-mail: don_parkman@agilent.com
Web site: http://www.agilent.com
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