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Product Showcase

TechCut 4

The TechCut 4 is a precision low speed saw excellent for cutting smaller, delicate samples that cannot tolerate excessive friction and heat caused by high speed sectioning. The gravity-fed cutting system uses adjustable weights to apply or counterbalance downward force to the sample during sectioning. With a 3-6 inch blade range, samples up to 2 inches can be sectioned. Features include: Touch pad switches control all functions; Variable speed with LED: 10-500 rpm (10 rpm increments); Micrometer sample indexing, 1 µm resolution; Corrosion-resistant aluminum & stainless steel construction.

Allied High Tech Products Inc

Contact Gary Liechty

Tel. +1 310 635 2466

Fax +1 310 762 6808



InP Etching Solutions

Unaxis introduces InP dry etching solutions spanning R&D projects from prototype fabrication to volume production. Systems can be configured with either RIE or ICP process technology on manual or automated wafer handling platforms. Reproducible, uniform thermal coupling between the substrate and a heated recirculating fluid electrode is accomplished with mechanical or electrostatic clamping and flow backside helium. Processes developed on entry level Unaxis systems are easily transferred to production platforms with features that increase maintenance intervals and improve cost-of-ownership. Whether shallow or deep etching, frontside features or backside vias, Unaxis has a hardware and process solution to meet your application needs.

Unaxis Semiconductors

Contact Notker Kling

Tel. +1 727 577 4999



Double Doping Cluster Source

The use of the Double Doping Cluster Source on one 4.5 inch flange increases the capacity of your MBE system (e.g. GEN II) by only needing a single port for Be and Si doping. Each cell has a conical 5 ccm PBN crucible. After melting the source material in an upwards position, the doping source can even be used in downward ports. A water-cooled shielding between the single cells reduces their thermal interaction. Cross contamination is minimized by the use of individual shutters separated by a Ta shielding.

MBE Components

Contact Dr. Eberl MBE-Komponenten GmbH

Tel. +49 7033 6937 0

Fax +49 7033 6937 20



MicroLine 500

The MicroLine 500 automatically performs critical dimension measurements on cassettes of wafers. The system employs an auto-loading robot, pre-aligner and motorized positioning stage along with pattern-recognition software to load, align, and measure wafers without operator intervention. It provides measurement accuracy of 0.01 micron with 4 nm (one Sigma) repeatability. The system includes an extremely flexible, proprietary programming language (MCL) that offers the user full control of the system s functionality.

Micro-Metric Inc

Contact Micro-Metric Inc

Tel. +1 408 452 8505

Fax +1 408 452 8412



Hall Effect Measurement Systems

The new 7600/7700 series are the most sophisticated electronic transport measurement systems available. Hall coefficient, voltage, carrier density etc, measurements can be made on samples with resistances from 0.1 mΩ to 80 GΩ, in fields to 2 tesla and temperatures from 15K to 800K. Options including multiple contact I-V measurements, 4-sample or 6 inch wafer capability, and QMSA software (extracts the mobility and concentration of each carrier species in multi-layer materials) are available.

Lake Shore Cryotronics Inc

Contact Lake Shore Cryotronics Inc

Tel. +1 614 891 2244

Fax +1 614 818 1600



C2 Optical Surface Analyzer

Candela Instruments C2 Optical Surface Analyzer offers fully automated surface inspection for 2 inch to 8 inch optoelectronic or semiconductor wafers. C2 combines scatterometry, reflectometry, ellipsometry and optical profilometry to measure reflectivity and topographic variations across the entire wafer surface. Applications include: Defect Detection and Classification (particles, stains, pits, bumps, and scratches); Film Thickness Uniformity; and Surface Roughness measurements.

Candela Instruments

Contact Gale Lane

Tel. +1 510 413 0900



CS International to return to Brussels – bigger and better than ever!

The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.

Join us face-to-face between 28th – 29th June 2022

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
  • Email  or call +44 (0)24 7671 8970 for more details.

*90% of exhibition space has gone - book your booth before it’s too late!


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