Toshiba Expands Industry-Leading Portfolio of Microwave Components With New Modules for Telecommunications Infrastructure Equipment

Source: Toshiba America Electronic Components, Inc.

Toshiba Adds Devices for VSAT Satellite Terminals and Wideband CDMA Cellular Basestations to Its Broad Family of MMICs

Phoenix, AZ. Expanding its line-up of broadband wireless and telecommunications infrastructure integrated circuit (IC) solutions, Toshiba America Electronic Components, Inc. (TAEC)* has extended its family of Gallium Arsenide (GaAs) monolithic microwave integrated circuit (MMIC) modules with the addition of two new devices. Toshiba s new GaAs MMICs are targeted for use in very small aperture terminal (VSAT) satellite communications and wideband code division multiple access (W-CDMA) solutions.

Offering a unique combination of high gain, high power and outstanding linearity, these new modules include a 1.5 watt (W) Ku-Band (14.0 to 14.5 Gigahertz (GHz)) MMIC amplifier for VSAT satellite terminals and a 3W S-Band (2.05 to 2.23GHz) MMIC power amplifier for W-CDMA basestations, microcells and repeaters. These devices join Toshiba s extensive MMIC family, which now offers manufacturers the broadest range of microwave components available in the marketplace. Toshiba is showcasing its latest MMIC offerings at the IEEE MTT-S International Microwave Symposium in Phoenix, Ariz., May 22-24, in booth #3327.

"Complementing Toshiba s broad lineup of microwave components, our newest MMICs address two of the industry s fastest growing market segments: VSAT terminals and W-CDMA infrastructure equipment," said Ed Monzon, senior business development manager, Microwave and RF Devices for TAEC. "Our MMICs are designed using an advanced GaAs process to achieve the bandwidth and frequency required for these high-data-rate applications, and address the market need for high-performance, cost-effective and reliable microwave solutions." Target applications for Toshiba s 1.5W Ku-Band MMIC, designated the TMD1414-1G, include power amplifiers for consumer and enterprise VSAT networks, and drivers for solid state power amplifiers used in satellite communications. VSAT networks deliver global, satellite-based broadband communications services including voice/fax, Internet, data and multimedia communications.

The TMD1414-1G is housed in a small semi-hermetic sealed ceramic package for low cost and excellent reliability. Internally matched to 50 ohms, the device reduces part count and lowers the tuning costs of wireless applications. High gain, power and linearity of the device over its 14.0 to 14.5GHz frequency band further simplifies the design process. The TMD1414-1G features the high RF output power and high power gain needed to support a broad range of wireless applications in the Ku-band. It also demonstrates the high linearity required for the more complicated, vector-oriented modulation schemes characteristic of emerging high-data-rate VSAT applications. These features combine to offer significant cost and performance advantages over alternative microwave solutions for this operating frequency.

Toshiba s first 3W S-Band MMIC for the W-CDMA market, designated the TMD2121-3A, is targeted for W-CDMA power amplifiers, microcells and repeaters. An emerging broadband wireless standard, W-CDMA enables very high-speed multimedia services such as voice, Internet access and videoconferencing.

The TMD2121-3A is currently the highest-power internally matched S-band MMIC designed for the W-CDMA market. Internally matched to 50 ohms, the device simplifies the design process and streamlines time-to-market. High gain reduces part count and design complexity, and its 3W high RF output power makes it ideal for the final output device of repeater and microcell applications. With -52dBc IM3 performance on two-tone tests at a 17dBm single carrier level, the TMD2121-3A has superior linearity for the extremely demanding modulation schemes.

Toshiba s industry-leading line-up of microwave products also includes L-, S-, C-, X-, and Ku-band components with output power levels ranging from 100 milliwatts (mW) up to 60W. The company offers a full spectrum of microwave solutions for handsets, basestations and satellite terminals and gateways -- all providing high power, efficiency and frequencies for advanced communications applications.

*About TAEC Toshiba America Electronic Components, Inc. (TAEC) offers the industry s broadest line-up of semiconductor, display and storage solutions for the computing, wireless, networking and digital consumer markets. Combining quality and flexibility with design engineering expertise, TAEC brings advanced next-generation technologies to its OEM customers.

TAEC is an independent operating company owned by Toshiba America Inc., a subsidiary of the $54 billion (FY 1999 recorded sales) Toshiba Corp., the second largest semiconductor company worldwide in terms of global sales for the year 2000. Toshiba Corp. is a world leader in high-technology products with more than 300 major subsidiaries and affiliates worldwide. For additional company and product information, please visit TAEC s web site at http://wwww.chips.toshiba.com.

For technical inquiries, please e-mail Tech.Questions@taec.toshiba.com For further information please contact Suzanne Foxworth,
suzanne_foxworth@benjamingroup.com, or Penny Capra, penny_capra@benjamingroup.com, both of Benjamin Group/BSMG Worldwide, 949-260-1300, for Toshiba America Electronic Components, Inc.

(Photo: http://www.newscom.com/cgi-bin/prnh/20010521/LAM004)

Contact: Suzanne Foxworth suzanne_foxworth@benjamingroup.com or Penny Capra penny_capra@benjamingroup.com both of Benjamin Group/BSMG Worldwide Tel: 949-260-1300 for Toshiba America Electronic Components, Inc.