Kopin Supplying Advanced InGaP HBT Wafers for Yokogawa Electric's 40 Gbps Optical Network Modules
First Commercial Use of InGaP HBTs for OC-768 Applications
TAUNTON, Mass. Kopin Corporation today announced that it is supplying high-performance indium gallium phosphide (InGaP) heterojunction bipolar transistors (HBTs) to Yokogawa Electric Corporation of Tokyo, Japan. Yokogawa is integrating the HBTs into its advanced 40 gigabit-per-second (Gbps) optical network modules, the world s first modules to use InGaP HBT technology for high-speed OC-768 applications.
"Yokogawa s new HBT-based 40 Gbps modules deliver the performance required for the most demanding optical network applications, and greatly expand the opportunities for our gallium arsenide-based HBT products, said Dr. John C.C. Fan, Kopin s president and chief executive officer. "The transistors run at extremely high frequencies, with peak current-gain cutoff frequency (ft) of 190 GHz and maximum frequency of oscillation (fmax) of 230 GHz. Yokogawa s products represent a new milestone, clearly demonstrating how Kopin s InGaP HBTs are moving to higher performance commercial platforms.
"We are extremely pleased that our collaboration with Kopin has yielded the high-performance InGaP HBT platform required for our 40 Gbps module program, stated Dr. Akira Miura, General Manager of Yokogawa s Development Project Center. "The InGaP HBT delivers superior output power and jitter characteristics, allowing our circuit modules to deliver excellent performance at a very competitive cost. Yokogawa has released an entire family of OC-768 modules based on the InGaP HBT platform, including driver modules for lithium niobate and electro-absorption modulators, as well as logic circuit modules for multiplexer, demultiplexer and flip-flop functions. Kopin is a proven leader in high-volume HBT transistor wafer manufacturing, and it has the state-of-the-art infrastructure necessary for supporting our production programs.
About Yokogawa
Yokogawa s global network of 18 manufacturing facilities, 71 affiliate companies and over 200 sales and engineering offices span 28 countries. Since its founding in 1915, the US$3 billion company has been engaged in research and innovation of the highest order, securing over 4,500 patents and registrations, including the world s first DCS and digital flow and pressure measurement sensor. Test and measurement systems are a core business focus of Yokogawa. For more information about Yokogawa Electric Corporation, please visit its Web site at www.yokogawa.com
About Kopin
Kopin is a leading developer and manufacturer of high-resolution, flat-panel display products and HBT wafers for telecommunications and digital imaging applications that enhance the delivery and presentation of video, voice and data. The Company has combined advanced AMLCD and integrated circuit technology to produce its CyberDisplay(TM) family of ultra-small, high-density imaging devices. The Kopin CyberDisplay family has won many international awards for innovation in the past two years, and now includes the CyberDisplay 1280, 640C, 640M, 320 and 320C - providing OEMs with powerful, high-quality display solutions for devices including consumer electronics such as camcorders, digital cameras and next-generation Internet wireless handsets. High speed, small size, power efficiency and signal quality make Kopin s HBT wafers the choice for power amplifiers used in current and next-generation wireless handsets. Telecommunication providers are using Kopin s HBT transistor wafers for power amplifier circuits used in wireless digital phones, and gigabit circuits for broadband and Internet data transmission. For more information, please visit www.kopin.com.
CyberDisplay is a trademark of Kopin Corporation.
Statements in this news release about Kopin Corporation s agreement to supply Yokogawa with advanced InGaP HBT wafers may be considered "forward-looking statements under the "Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. These statements involve a number of risks and uncertainties that could materially affect future results. Among these risk factors are general economic and business conditions and growth in the flat-panel display and gallium arsenide integrated circuit and materials industries, the impact of competitive products and pricing, availability of third-party components, availability of integrated circuit fabrication facilities, cost and yields associated with production of the Company s CyberDisplay imaging devices and HBT transistor wafers, loss of significant customers, acceptance of the Company s products, continuation of strategic relationships and other risk factors and cautionary statements listed from time to time in the Company s periodic reports and registration statements filed with the Securities and Exchange Commission, including but not limited to the Company s annual report on Form 10-K for the year ended December 31, 2000.
Contact:
Matthew Micci, VP Sales & Mktg.
Richard Sneider, CFO
Kopin Corporation
(508) 824-6696
mmicci@kopin.com
rsneider@kopin.com
or
Ehren Lister
Account Executive
Sharon Merrill Associates, Inc.
(617) 542-5300
elister@investorrelations.com
Matthew Micci, VP Sales
& Mktg.
Richard Sneider, CFO
Kopin Corporation
(508) 824-6696
mmicci@kopin.com
rsneider@kopin.com
or
Ehren Lister
Account Executive
Sharon Merrill Associates, Inc.
(617) 542-5300
elister@investorrelations.com
E-mail: elister@investorrelations.com
Web site: http://www.kopin.com
