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Technical Insight

New Products (GaAs News)

W-CDMA PAs from RFMD Greensboro, NC. RF Micro Devices has introduced three new GaAs HBT linear variable gain amplifiers. Two amplifiers, the RF2381 and RF2377 TX, are part of a complete single-mode W-CDMA chipset solution previously announced in February 2000. Operating from a single 2.73.3 V power supply, all three amplifiers feature a 50 dB linear gain control range, high linearity, high gain and a low noise figure. Manufactured using GaAs HBT process technology, these components are offered in six-lead plastic SOT packages (SOT23-6). Celeritek Unveils 3.5 GHz W-CDMA PA Santa Clara, CA. Celeritek has unveiled a new W-CDMA power amplifier for wireless data transmission at 3.5 GHz. The part is manufactured in a 4 4 mm, leadless chip carrier package. The CMM3566-LC is a linear PA intended for use in subscriber units and base stations operating from 3.45 to 3.50 GHz. Typical features include operation at 7.0 V, 30 dB gain at operating output and +24 dBm of linear output power (W-CDMA). Fujitsu Expands GaAs MMIC PA Line San Jose, CA. Fujitsu Compound Semiconductor, Inc. is introducing four new millimeter-wave, high power MMIC amplifiers manufactured with a 0.25 m PHEMT process. Covering the 17.5 to 31.5 GHz frequency band with output power ranging between 26 and 31 dBm, these new devices are designed for point-to-point or point-to-multipoint radio link and Local Multipoint Distribution System (LMDS) applications. Stanford Microdevices Unveils 3G Base Station Components Sunnyvale, CA. Stanford Microdevices, a fabless GaAs manufacturer, has unveiled a new line of GaAs and SiGe transceiver ICs and multichip modules for 3G wireless base station applications, including modulator, mixer, amplifier, transmitter and receiver functions. Production volumes are targeted for mid-2001. "For Stanford Microdevices, this new line represents an initial step into products featuring higher levels of functionality and integration for the fast-growing mobile arena," said Gary Gianatasio, VP and general manager of mobile wireless infrastructure products.
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