Technical Insight
RFMD, Qualcomm Partnership Unveils New PA Module (GaAs News)
RFMD, Qualcomm Partnership Unveils New PA Modules RF Micro Devices and Qualcomm CDMA Technologies (QCT) have developed a series of highly integrated PA modules, the second set of products to come from the partnership between the two companies. Based on a RFMD s GaAs HBT process, "the new PA3300 PA module continues QCT s commitment to develop CDMA RF products that enable manufacturers to develop more sophisticated yet cost-effective wireless handsets," said QCT s marketing and product manager, Johan Lodenius. "By teaming together from the concept stage through development, we were able to create a highly integrated and innovative PA module optimized to support and complement Qualcomm s total CDMA solution," said RFMD s Jerry Neal. The new PA module forms part of a highly integrated CDMA chipset solution. The total package size of the 13-pin land grid array (LGA) package is 6 7.5 mm2, and features integrated bias control and compensation for consistent performance of gain, quiescent current and Adjacent Channel Power Rejection (ACPR). The US cellular module delivers 28 dBm linear output power with 28 dB gain from a 3.2 V supply. Sample shipments for cellular and PCS are available now, with Korean PCS and JCDMA samples expected to follow in the first quarter of 2001, and an IMT band version expected to sample in the second quarter of 2001.
