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Technical Insight

CS-MAX Expo takes center stage in July

CS-MAX is the first conference to cover the high-volume manufacturing of all types of commercially significant compound semiconductor devices. Marie Meyer provides a preview.
The Compound Semiconductor Manufacturing Expo CS-MAX for short is a unique new event for the compound semiconductor industry (see organizing committee). To be held at the Hynes Convention Center in Boston, MA on 911 July 2001 (see ), this is the first conference to bring together the three major device types that are currently in high-volume production transistors/integrated circuits, laser diodes and fiber-optic components, and LEDs as well as all of today s most commercially important materials systems: GaAs, InP, GaN and SiC. The mission statement for CS-MAX is to encourage productive interchanges among engineers and managers engaged in high-volume manufacturing of compound semiconductor devices and to provide a showcase for new ideas from semiconductor equipment and materials companies that can increase the productivity of compound semiconductor fabs. The technical program The technical program at CS-MAX will include approximately 100 presentations, organized into the following five tracks:
  • Microelectronics
  • Laser Diodes and Fiber Optic Components
  • LEDs
  • Characterization
  • Epitaxy
  • All of the papers will focus on high-volume manufacturing issues. Microelectronics In the plenary session Patrick Jenkins will analyse the wealth of experience that Vitesse has generated at its Colorado Springs facility, the first and largest 6 inch GaAs fab in the world. In that same session Bob Van Buskirk, president and CEO of Stanford Microdevices, will discuss the application of the fabless semiconductor model to the RF components industry. Other presentations in this track include:
  • Enhancement-mode PHEMT Processing Technology for High-Efficiency Power Amplifiers for Wireless Communications, presented by Gene Tkachenko, Alpha Industries;
  • Back-side Processing of GaAs Wafers, presented by Henry Hendriks, M/A-COM;
  • Application of X-Ray Lithography to GaAs ICs, presented by Donald Bailey, SAL;
  • Increasing Capacity Together With Reducing Cycle Time A Look at Productivity Improvement Process at Nortel s GaAs Wafer Fab, presented by Wladyslaw Danielak, Nortel Networks.
  • Laser Diodes and Fiber Optic Components The plenary session will feature a paper entitled "The PCAD Program: Advances in Photonic Computer Aided Design" from Matthew Goodman, chief scientist at Telcordia Technologies. Jim Tatum, VCSEL technology manager at Honeywell will discuss the commercialization of VCSEL technology. Other presentations in this track will include:
  • Challenges and Solutions for VCSEL Manufacturing, presented by Geoffrey Rosenthal, AXT;
  • Indium Phosphide Photonic Integration for DWDM Applications, presented by Charles Huang, Anadigics;
  • On the Fast Track: Tapping into the Power of SPC and Demand-Flow Tools to Jump Start Production, presented by Tom Dearmin, Lasertel;
  • Successful Implementation of Manufacturing Execution Systems in Fiber Optic Component Manufacturing, presented by Greg Sowle, Camstar Systems.
  • LEDs The explosion in LED manufacturing in Taiwan will be discussed in the plenary session by Jim Chi, deputy director of the Industrial Technology Research Institute in Taiwan. There will also be a presentation on high-volume production of InGaN-based LEDs by Kiyoshi Komatsu of Nichia. Attendees will also get a preview of what could be a major change in business practices in the LED industry. Cameron Miller and colleagues from the National Institute of Standards and Technology (NIST) will make a presentation on NIST s efforts to develop standards for luminous intensity and luminous flux for LEDs. The purpose of this work is to establish much-needed standards whereby the performance of LEDs can be objectively measured at present LED comparisons are often done on an "apples to oranges" basis. Characterization It seems that every compound semiconductor fab is looking for the right combination of characterization techniques to increase yields without causing bottlenecks. Numerous techniques will be discussed at CS-MAX. Presentations will include:
  • Quantitative X-ray analysis of GaAs- and InP-based HBTs for Rapid In-Production-Line Material Qualification, presented by Peter Velling, Innovative Processing AG;
  • Contactless Electromodulation And Surface Photovoltage Spectroscopy For The Room Temperature, presented by Fred Pollak, Brooklyn College, CUNY;
  • Topographic Assessment of EL2 and Implantation Dose Homogeneity in Semi-Insulating GaAs Wafers, presented by Peter Hiesinger, Fraunhofer IAF;
  • Characterization of Multi-Carrier Heterostructure Devices with Quantitative Mobility Spectrum Analysis and Variable Field Hall Measurements, presented by Gang Du, Lake Shore Cryotronics;
  • FTIR Characterization and Control of Compound Semiconductor Epi Layers, presented by Peter Solomon, On-Line Products.
  • Epitaxy The vast majority of compound semiconductor devices are based on epitaxial structures, and sophisticated techniques such as MBE and MOCVD are vital to the future progress of the industry. With this in mind, CS-MAX will include a lively track on epitaxy, focusing on the needs of high-volume producers. Presentations will include:
  • High Volume and Flexibility in an MOVPE Foundry, presented by Jim Ermer, Spectrolab;
  • Integrated MOCVD System Engineering and Fab Management, presented by Koh Matsumoto, Nippon Sanso;
  • Productivity for Epi Manufacturing- Equipment and Support, presented by Bernd Schulte, Aixtron;
  • Epi Layer Temperature Measurement and Control in Large Scale MOCVD Manufacturing, presented by Jeff Bodycomb, Emcore;
  • Automated Bulk Distribution System For Liquid Organometallics in MOCVD Production, presented by Ravi Kanjolia, Epichem;
  • Control of Moisture in Arsine and Phosphine Delivery Systems for MOCVD Processes, presented by Virginia Houlding, Matheson Tri-Gas;
  • Metalorganics Safety and Handling, presented by Gregory M Smith, Akzo Nobel.
  • The exhibit The silicon industry is famous for its massive annual equipment exhibitions, such as Semicon West. The popularity of these events is due to their effectiveness as showcases for new ideas and commercially available solutions to important problems. In the past five years the compound semiconductor industry has seen a rapid maturation of its infrastructure. The CS-MAX exhibition will include every major manufacturer of compound semiconductor-related equipment and materials. It is, therefore, an outstanding opportunity for fab managers and process engineers to bring themselves up to date on what s new a "one-stop shop" for everything needed for a compound semiconductor fab. The courses Educational opportunities at CS-MAX will include two major multi-presenter workshops: l Manufacturing InP Integrated Circuits will be chaired by Owen Wu, president of GCS. InP-based ICs are becoming increasingly important for the future prospects of the compound semiconductor industry. However, while there is a substantial body of knowledge about fabricating discrete optoelectronic devices such as laser diodes from InP, there is a critical shortage of experience in fabricating ICs from this material. This workshop will provide an overview of practical issues that must be addressed by any company that is interested in producing InP circuits. l OIDA Roadmap on Solid State Lighting will be chaired by Arpad Bergh, president of the Optoelectronics Industry Development Association. It is widely recognized that solid-state lighting represents an exciting opportunity for the LED industry. But there are numerous issues that must be dealt with, such as the timing for the emergence of high-volume applications, and the types of LEDs that will be required. The OIDA, whose mission is to promote the global expansion of the optoelectronics industry, is spearheading the effort to stimulate discussion of these issues. CS-MAX will also include several single-presenter tutorials, including:
  • Plasma Processing of IIIV Materials, presented by Stella Pang, University of Michigan;
  • Fabricating and Packaging Diode Lasers and VCSELs, presented by Kurt Linden, Axcel Photonics;
  • CAD for III-V MMICs, presented by Wolfgang Bosch, Filtronic.
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