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Technical Insight

Assembly cell gives laser soldering a boost (Product Showcase)

Palomar Technologies new laser diode attach (LDA) system an assembly cell that automates the packaging of InP laser diodes onto carriers prior to assembly into optoelectronic packages includes a void-free eutectic solder interface that controls thermal and electrical connections needed to generate a stable transmission of laser light. The LDA assembly cell integrates a pulse-heat system that drives a patented eutectic hot bar heater to generate the eutectic solder interface. The programmable closed loop system gives tightly coupled control and repeatability of eutectic reflow processes while maintaining a final placement accuracy of 5 m. A preheated blanket gas eliminates material oxidation during eutectic processing. For InP diode assembly, the assembly cell positions the substrate, carrier or sub-mount in the pulse-heat unit, places a eutectic preform, heat spreader/spacer and a second preform, places the laser diode and pulse-heats the entire stack. This sub-mount is then placed onto a thermal electric cooler in the butterfly or transistor outline (TO) optoelectronic package typically used to package transmitters, receivers, transceivers and amplifiers. The LDA accommodates photodetector assemblies, and is able to handle various formats of presentation including expanded wafer, 2 inch and 4 inch waffle and gel paks (see ). Contact Bruce Hueners, Palomar Technologies, 2230 Oak Ridge Way, Vista, CA 92083, USA
Tel. +1 760 931-3600
Fax +1 760 931-5191
Web www.palomartechnologies.com
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