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Technical Insight

MRSI introduces a new bonding system (Product Showcase)

The new MRSI 505 High Frequency Assembly Work Cell is a system designed for eutectic bonding of RF and microwave components. It can be configured for several component-attach technologies including in situ eutectic bonding, conductive and non-conductive epoxy attach, integrated eutectic bonding in reflow chamber and flip-chip bonding. The MRSI 505 is thermally and mechanically stable and supports multiple eutectic processes such as gold silicon, gold tin and gold germanium. Capabilities include a heated assembly station with fast closed-loop temperature ramping. For example, the MRSI 505 High Frequency automates the placement of GaAs die with air bridges and vias with controlled programmable contact force. MRSI also offers an automated eutectic preform feeder based on its MRSI-505 platform. Called the Photonics Optical Assembly Work Cell, eutectic bonding is simplified by using a feeder that handles reels of solder and cuts a variety of preform sizes for immediate pick and place during the assembly process. The system can be configured for several component-attach technologies for epoxy die attach, eutectic and flip-chip bonding. Applications include filters, switches and amplifiers, transmitters and receivers, and other laser-based devices (see ). Contact Dan Crowley, MRSI, 101 Billerica Avenue, Building 3, North Billerica, MA 01862-1256, USA
Tel. +1 978 667 9449
Fax +1 978 667 6109
Web www.mrsigroup.com
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