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Technical Insight

August Technology inspects wafer bumps (Product Showcase)

August Technology s 3Di-8000 is a high-speed bump and wafer inspection system incorporating a 3-D Rapid Confocal Sensor with 2-D bump and active die inspection. The 3Di-8000 measures the height and co-planarity of solder and gold bump interconnects in packages or circuit boards. Wafers can be analyzed in a range of diameters from 75 to 300 mm. "The bump height is critical to the functionality of devices using wafer-level interconnect technology," said product manager Dan Nelson. "The 3Di-8000 enables bump height detection and combines high speed with an accuracy of greater than 2 m." Contact Claus Nielsen, August Technology, 4900 West 78th Street, Bloomington, MN 55435, USA Tel. +1 952 259 1613 Fax +1 952 820 0060 E-mail Claus.Nielsen@AugustTech.com
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