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Technical Insight

New Karl Suss probes reduce device failures (Product Showcase)

While ball grid arrays (BGAs) are designed to house higher densities of ICs and telecom devices, the ability to perform testing at these densities becomes increasingly difficult. Karl Suss has introduced the PA200BGA to assess BGA structures prior to the packaging process. This can save additional processing steps and eliminate device failures. The automatic probe system features a robotic loader and pre-alignment function that uses programmable probe heads, which can be switched automatically between carrier and BGA measurement set-ups. Contact Veronica Miller, Karl Suss America, 228 Suss Drive, Waterbury Center, VT 05677, USA Tel. +1 800 685 7877 Fax +1 802 244 5103 E-mail vmiller@suss.com
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