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Technical Insight

Toshiba cell packs combine functions (New Devices)

San Jose, CA. Toshiba has expanded its family of Cell Pack RFIC packages. Cell packs combine components and are designed to offer multiple functions for mobile RF and Bluetooth devices, eliminating the need for discretely mounted wide-band amplifiers, mixers, attenuators and SPDT switches. The series now includes three new wide-band amplifier packages for low voltage operation, and separate packages for crystal oscillator and SPDT switch functions. Each pack helps to reduce component count and board space. Toshiba s wide-band amplifier packs, designated TA4011FU/AFE, TA4012FU/ AFE and TA4016AFE, are housed in compact SMD packages, and are suited to PDA, cellular phone, portable computer, set-top box and tablet PC applications. For crystal oscillator functions required by all portable communications devices, the company s TA4014FT/FE and TA4015FT/FE packages (6 pin TU6 or ES6) reduce noise and improve stability. For switching, Toshiba s TG2210FT MMIC package targets SPDT functions for Bluetooth devices at 2.4 GHz. Manufactured using the company s GaAs process and packaged in a TU6, this pack features 30 dB of isolation and an insertion loss of 0.4 dB. www.chips.toshiba.com
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