Technical Insight
Showa Denko forms alliance with NTT-AT (Materials and Equipment)
Showa Denko and NTT Advanced Technology Corporation (NTT-AT) have entered into an agreement that will see Showa Denko manufacturing InGaP HBT epiwafers for NTT-AT. These epiwafers will be used to fabricate PAs for use in cellphone handsets. Demand for InGaP HBTs is expected to grow steadily over the next few years as third-generation cellular services are launched. InGaP/GaAs PAs offer advantages over AlGaAs/GaAs PAs, including higher power efficiency and lower operating voltages. Showa Denko produces substrates and epiwafers, including both LEDs and electronic devices. The agreement includes a commitment to tie-up NTT-AT s epitaxial growth and device evaluation capabilities with Showa Denko s volume manufacturing facilities. Showa Denko has begun a capacity expansion to increase output to 500 InGaP HBT epiwafers per month by September 2001. The expansion is expected to continue, reaching 2000 wafers per month in 2003.
