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Handheld evaluates 2.5 Gbit/s networks Agilent Technologies has unveiled an OC-48/STM-16 handheld tester designed to evaluate SDH, SONET, PDH and T-Carrier network services and equipment at data rates up to 2.5 Gbit/s. The N4553A can be applied to bit error rate analysis, error and alarm testing and automated network performance evaluation against numerous industry standards (e.g. G.821, G.826, M.2100 and M.2101). Multiple built-in interfaces also allow for line and ring network topologies to be tested at 16 different electrical and optical line rates and framing standards. Operating from either battery or mains, the company s tester weighs 5 pounds and can monitor up to 100 events simultaneously. It can also be operated in through-mode, mux/demux, OOS and ISM modes to test access network equipment prior to installation, or for passive monitoring (see ). Contact Sales, Agilent Technologies Test and Measurement, PO Box 4026, Englewood, CO 80155-4026, USA Tel. +1 800 452 4844 Web www.agilent.com/comms August offers Web-based support August Technology has launched clickService, a Web-based technical support program that allows remote access to its wafer, die and bump inspection systems. Using the system, issues with software and hardware settings can be identified and corrected remotely by August service engineers, or interactively to assist the customer in resolving an issue. August s on-line program is available as part of a system warranty or can be purchased outside of warranty as a service contract option. Contact Claus Nielsen, August Technology Corporation, 4900 West 78th Street, Bloomington, MN 55435, USA Tel. +1 952 259 1613 Fax +1 952 820 0060 E-mail Claus.Nielsen@AugustTech.com Robotic wax/spin-on bonder/debonder EV Group (EVG) has introduced a fully-automated wax bonding, spin-on adhesive and adhesive film bonding and de-bonding system for compound semiconductor applications. The robotic system performs temporary bonding of fragile wafers on coated carriers; the latter can be completely processed and later de-bonded and removed. The EV850 accommodates wafer diameters up to 6 inches, and can be configured for dry adhesive films or spin-on intermediate layers such as wax. This approach provides a high level of uniformity for spin-on wax coating and bubble-free bonding in controlled atmospheres, while increasing throughput and eliminating wafer breakage (see ). Contact Rose Gismondi, EV Group, 1210 Pontiac Avenue, Cranston, Rhode Island 02920, USA Tel. +1 401 784 0008 Fax +1 401 784 9933 E-mail r.gismondi@evgroup.com New reactor series from Emcore Emcore has expanded its range of Enterprise MOCVD reactors with the addition of the 300LDM and E450 series. Based on the company s existing TurboDisc vertical growth chamber configuration, the 300LDM targets the growth of long wavelength, infrared and visible laser structures, and VCSELs. The E450 reactor is designed to grow HBT, PHEMT and LED epiwafers used in wireless and solid-state lighting applications. "This expansion of our Enterprise reactor line also features our RealTemp optical control technology," said Paul Rotella, vice-president of the company s TurboDisc Tools Division. "This allows materials manufacturers to improve the quality of their materials, and facilitates a more efficient, accurate >and cost-effective production process, while improving yield" (see ). Contact Tom Miehe, Emcore Corporation, 145 Belmont Drive, Somerset, NJ 08773, USA Tel. +1 732 271 9090 Fax +1 732 271 9686 E-mail info@emcore.com Ansoft models foundry processes Ansoft has released version 8.7 of Serenade, the company s latest circuit and communication system design software. Created with the needs of MMIC and RFIC designers in mind, the latest version takes into account design considerations associated with foundry models. Serenade 8.7 applies Monte Carlo analysis to both circuit and system simulation engines, and allows the user to directly view the overall or individual circuit/system response based on specified component tolerances. Enhanced post-processing is also possible and includes animated plots to visualize circuits and systems, including such phenomena as the distortion resulting from non-linear behavior. Contact David DiOrio, Ansoft Corporation, 4 Station Square, Suite 200, Pittsburgh, PA 15219, USA Tel. +1 412 261 3200 Fax +1 412 471 9427 E-mail diorio@ansoft.com Cleaner flip-chip bonds and packages Targeting flip-chip, optoelectronics and advanced high-reliability packages and assemblies, Austin American s Mega II system features a closed-loop solvent (or water) method that cleans electronic assemblies without producing waste streams. The system is suited to precision cleaning for pre-wire bonding applications and pre-conformal coating, as well as tight-tolerance cleaning during flip-chip and post-ball attachment cleaning of ball-grid arrays. The system also includes wash and rinse cycles that incorporate a spray-under-immersion process. Agitation can be controlled to handle sensitive wire-bonded substrates or tight-tolerance flip-chip technology. An ultrasonic assist is available as an option for tough cleaning (see ). Contact Jon Phelps, Austin American Technology Corporation, 12201-160 Technology Blvd, Austin, TX 78727-6102, USA Tel. +1 512 335 6400 Fax +1 512 335 5753 E-mail jrphelps@aat-corp.com Repairs for damaged circuit boards The Professional Repair Kit from Circuit Technology Center (CTC) is designed to repair circuits, surface mount pads and gold contacts. The package comes with materials to repair burns and defects in the baseboard and masks, and includes dry film, epoxy-backed circuit frames, and replacement circuits that require no liquid epoxy. Also included are eyelets and setting tools for plated through-hole repair, circuit tracks to repair damaged circuits, epoxy and color agents for solder mask or baseboard repairs (see ). Contact Jeff Ferry, Circuit Technology Center, 45 Research Drive, Haverhill, MA 01832, USA Tel. +1 978 374 5000 Fax +1 978 372 5700 E-mail jferry@circuittechctr.com Aixtron upgrades reactor to 4 inch InP Aixtron has unveiled an MOCVD system with a capacity for either 5 4 inch or 8 4 inch InP wafers. In common with the company s established AIX 2400/2600G3 Planetary reactors, the system features a cassette-to-cassette robot for direct loading/unloading, an RF heating unit for fast cooling/heating cycles, and control of reactor boundary conditions. "The compound semiconductor industry is preparing for the next generation of 40 Gbit/s ICs based on InP," said president Holger Juergensen. "Very soon, 4 inch [wafers] will dominate the market, as was the case earlier with GaAs, and we expect InP-based optoelectronics to move quickly from 3 to 4 inch wafers" (see ). Contact Octavia Schirmer, Aixtron AG, Kackertstrasse 15-17, 52072 Aachen, Germany Tel. +49 241 8909 474 Fax +49 241 8909 149 E-mail ocs@aixtron.com Real time RF and microwave test Cascade Microtech has released the Nucleus 2.1 Prober, a control software package that monitors and analyzes RF and microwave data in real time using wafer maps and histogram statistics. Nucleus 2.1 runs on the company s existing semi-automatic probe stations, and supports its RF motorized position systems to ensure accurate setup. The Nucleus 2.1 also provides complete graphical sub-site control and is compatible with NT 2000 operating systems. Control and monitoring of the thermal chuck temperature is also facilitated. Contact Ellen Payne, Cascade Microtech, 2430 NW 206th Avenue, Beaverton, Oregon 97006, USA Tel. +1 503 601 1181 Fax +1 503 601 1002 E-mail ellen_payne@cmicro.com
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