Cree expands into packaged LEDs
This new product combines the company s XBright power chip with packaging technology designed for high power lighting applications using solid-state LED technology as a replacement for the incandescent bulb and other conventional light sources.
The XLamp will be available in multiple colors for all applications. Pre-production sampling of a 1 Watt surface mount XLamp devices is targeted for early in 2004 with initial production targeted for mid-year.
"The introduction of the XLamp product family is the next step in our plan to drive the market for LED based lighting,” said Chuck Swoboda, Cree s president and CEO. “We believe that our ability to offer a high power packaged LED product in addition to our power chip will be critical in accelerating the adoption of this important technology into the lighting market.
