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II-VI plans 100mm SiC scale-up with $7.5m fund

Wide-bandgap substrate manufacturer II-VI is aiming to lower the cost and improve the quality of 100mm semi-insulating SiC substrates under a $7.5 million effort largely funded by the US military.

The wide-bandgap materials division (WBG) of US substrate supplier II-VI has plans to produce 100 mm diameter semi-insulating SiC substrates for both military and commercial applications.

With $7.5 million to spend on a 3-year project largely funded by the US military, II-VI plans to address both technical and manufacturing issues surrounding the development of substrates that will be used to make wide-bandgap chips for high-power radar applications.

II-VI already sells SiC substrates commercially, and will use the funds to scale up its advanced physical vapour transport (APVT) technology to produce the larger products.

Systems based on SiC should operate at higher power efficiencies and with greater power-bandwidth RF performance than current technologies, while they should also require less supporting infrastructure.

"Next-generation [SiC] device development will rely to a very large extent on 100mm substrates," said Andy Souzis, the technology and program manager for II-VI's WBG group. "Currently such substrates are not commercially available, and suffer from inadequate quality."

The US military is providing $6 million towards the project through the Air Force Research Laboratory, the Missile Defense Agency and the Office of Naval Research. II-VI is shouldering the remaining $1.5 million through a cost-sharing scheme.

II-VI currently sells 50 mm and 75 mm diameter substrates in both 6H and 4H SiC polytypes.

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